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Microwave assembly

A technology of microwave components and components, which is applied in the microwave field, can solve problems such as difficulty in meeting the heat dissipation requirements of high-power microwave components, large size of microwave components, and low heat dissipation efficiency, and meet the needs of air-cooled heat dissipation, realize light weight, and facilitate connection Effect

Active Publication Date: 2020-04-17
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of microwave components with this structure is large, and it is difficult to meet the needs of microwave systems for small-sized microwave components; Single, low heat dissipation efficiency, difficult to meet the heat dissipation requirements of high-power microwave components

Method used

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  • Microwave assembly
  • Microwave assembly
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Embodiment Construction

[0028] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that these embodiments may be practiced without these specific details.

[0029] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0030] The heat dissipation design of microwave components in the prior art usually adopts single-sided assembly, that is, corresponding cooling fins are set on the bottom surface corresponding to the heating components in the microwave component ...

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PUM

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Abstract

The invention discloses a microwave assembly. The microwave assembly comprises a shell and an inner wall, wherein a containing cavity is formed in the shell, and the inner wall is accommodated in thecontaining cavity. The shell comprises: a first shell, which forms a first cavity with the inner wall, wherein the first cavity is provided with a first heating component group; a second shell, whichforms a second cavity with the inner wall, wherein the second cavity is provided with a second heating component group. At least one fin group composed of a plurality of fins is formed on the inner wall, and air ducts running through the side walls on two sides of the shell are arranged between the adjacent fins. According to the microwave assembly, the size can be effectively reduced, the volumeof the microwave assembly is further reduced, meanwhile, the heat dissipation capacity of the microwave assembly can be improved, the air cooling heat dissipation requirement of the microwave assemblyis met, and the microwave assembly is beautiful in overall layout and convenient to assemble, and is conducive to improving the production and assembly efficiency.

Description

technical field [0001] The present invention relates to the field of microwave technology, and more specifically, the present invention relates to a microwave component. Background technique [0002] With the development of economy and the advancement of science and technology, people are using more and more microwave signals in communication. The reception and transmission of microwave signals need to be completed through the cooperation of various microwave components. Such microwave components are precision instruments, which need to be properly protected during use, especially for the heat dissipation problem during the working process of microwave components. Requires optimization. In the design of microwave components, it is often encountered that there are heating components installed inside the microwave components, and the application scenarios of microwave components can only adopt the air-cooled heat dissipation mode. Therefore, it is necessary to design a reaso...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K5/02H05K9/00H01R13/629H01R13/646H01R13/6581
CPCH05K7/2039H05K5/0217H05K9/002H01R13/646H01R13/629H01R13/6581
Inventor 刘勇
Owner BEIJING INST OF RADIO MEASUREMENT