Cathode assembly having a dual position magnetron and centrally fed coolant

Abstract

Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets. In some embodiments, the rotatable magnet assembly is configured to move vertically.

Description

technical field [0001] Embodiments of the present disclosure generally relate to magnetrons used in physical vapor deposition chambers for substrate processing. Background technique [0002] Sputtering, or physical vapor deposition (PVD), has long been used to deposit metals and related materials in the fabrication of semiconductor integrated circuits. The use of PVD has expanded to deposit metal layers onto the sidewalls of high aspect ratio holes, such as vias or other vertical interconnect structures. Currently, advanced sputtering applications include depositing materials with high stress and high ion density into these vias. [0003] For example, titanium, tantalum, etc. have been used in through silicon via (TSV) applications. The inventors have observed that in such applications utilizing highly stressed target materials and thus high power, due to high target temperature and insufficient cooling, the target starts to crack and buckle. Although coolant has been use...

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Problems solved by technology

However, changing the power is laborious and requires constant monitoring of the deposition rate of the chamber

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