Bonding machine lead mechanism and working method

Abstract

The invention discloses a bonding machine lead mechanism which is fixedly installed on a bonding machine base. The mechanism comprises an installation frame fixedly installed on the base, a lead clampfixedly connected to the installation frame and a wire feeding mechanism arranged on the base. The lead clamp comprises a displacement amplifier fixedly installed on the lead clamp, a driving motor connected with the displacement amplifier, a pair of connecting bridge plates in transmission connection with the driving motor, a left clamping jaw and a right clamping jaw, wherein the left clampingjaw and the right clamping jaw are connected to the other ends of the pair of connecting bridge plates. In the invention, a servo motor and a first stroke cylinder drive the lead clamp to adjust a metal wire output by a wire feeding part; the metal wire is welded on a chip metal layer; a tension generated by the metal wire in an adjusting process is fed back according to a tension measurement andcontrol unit; and adjusting positions of a second bonding point and the lead clamp are accurate, and welding failure caused by over-high tension of the metal wire is avoided.

Description

technical field [0001] The invention belongs to the field of bonding machine design, in particular to a bonding machine lead wire mechanism and a working method. Background technique [0002] In the process of wire bonding technology, heat, pressure, and ultrasonic waves are used to perform three thermocompression bonding at the same time to complete. When the first bonding point is completed, the lead clip moves to the second bonding point and is connected to the chip or electrode. The metal wire forms a line arc under the pressure of the lead clamp. Due to the characteristics of the metal wire itself, the metal wire forming the line arc itself has a certain tension. The tension of the metal wire and the clamping force of the line clamp directly affect the bonding quality. and bonding efficiency; the existing bonding machines are usually unable to sense the tension of the metal wire itself, so the lead clamp is used for multiple adjustments to complete the bonding, so that ...

AI Technical Summary

Problems solved by technology

[0002] In the process of wire bonding technology, heat, pressure, and ultrasonic waves are used to perform three thermocompression bonding at the same time to complete. When the first bonding point is completed, the lead clip moves to the second bonding point and is connected to the chip or electrode. The metal wire forms a line arc under the pressure of the lead clamp. Due to the characteristics of the metal wire itself, the metal wire forming the line arc itself has a certain tension. The tension of the metal wire and the clamping force of the line clamp directly affect the bonding quality. and bonding efficiency; the existing bonding machines are usually unable to sense the tension of the metal wire itself, so the lead clamp is used for multiple adjustments to complete the bonding, so that the bonding efficiency and accuracy are not high

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