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Silicon wheat system packaging structure and preparation method of silicon wheat system packaging structure

A system packaging and silicon microphone technology, which is applied in the direction of microphone mouth/microphone accessories, sensors, electrical components, etc., can solve the disadvantages of miniaturization of silicon microphone system packaging structure, decrease in sensitivity and signal-to-noise ratio of silicon microphone, metal cover and Solve problems such as the failure of the substrate welding structure to achieve the effect of improving the sound transmission distance, avoiding the cracking of the silicon diaphragm, and preventing the failure of welding

Active Publication Date: 2021-08-24
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing silicon microphone packaging structure, the silicon microphone chip is usually exposed, or only a front cavity structure is provided, so that the external sound pressure directly acts on the silicon diaphragm, or the sound pressure travel is relatively short, so when the sound pressure change intensity exceeds a certain When the value is high, it may impact the silicon diaphragm and cause the silicon diaphragm to break
At the same time, the existing metal cover of the front cavity is usually mounted on the substrate. When cutting, the warping of the substrate will easily lead to failure of the welding structure between the metal cover and the substrate, affecting the packaging effect
At the same time, due to the single-sound cavity structure, when the external sound signal is weak, the sound pressure signal will be weaker, which will affect the sound collection effect, resulting in a decrease in the sensitivity and signal-to-noise ratio of the silicon microphone.
In addition, the conventional packaging structure adopts the method of direct stacking, resulting in a large package size, which is not conducive to the miniaturization of the packaging structure of the silicon wheat system

Method used

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  • Silicon wheat system packaging structure and preparation method of silicon wheat system packaging structure
  • Silicon wheat system packaging structure and preparation method of silicon wheat system packaging structure
  • Silicon wheat system packaging structure and preparation method of silicon wheat system packaging structure

Examples

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no. 1 example

[0044] see figure 1 , this embodiment provides a silicon microphone system packaging structure 100, which has a high degree of integration, can reduce the package size, and can improve the sensitivity and signal-to-noise ratio of the product, and can avoid the silicon vibration caused by the impact of the sound pressure change on the silicon diaphragm. Membrane rupture while avoiding solder failure problems.

[0045] The silicon wheat system packaging structure 100 provided in this embodiment includes a first substrate 110, a second substrate 130, a silicon wheat chip 150, a front cavity cover 170 and a rear cavity cover 190, and the silicon wheat chip 150 is mounted on the first substrate 110- side, the front cavity cover 170 is mounted on the side of the first substrate 110, and is covered outside the silicon wheat chip 150, the second substrate 130 is provided with a sound transmission groove 131, and the first substrate 110 is mounted on the second substrate 130 On the ot...

no. 2 example

[0058] see figure 2 , this embodiment provides a silicon wheat system packaging structure 100, its basic structure and principle and the technical effects produced are the same as those of the first embodiment. Corresponding content in the embodiment. Compared with the first embodiment, the difference of this embodiment lies in the opening position of the second sound inlet hole 171 .

[0059]In this embodiment, the silicon wheat system packaging structure 100 includes a first substrate 110, a second substrate 130, a silicon wheat chip 150, a front cavity cover 170 and a rear cavity cover 190, and the silicon wheat chip 150 is mounted on the first substrate 110- side, the front cavity cover 170 is mounted on the side of the first substrate 110, and is covered outside the silicon wheat chip 150, the second substrate 130 is provided with a sound transmission groove 131, and the first substrate 110 is mounted on the second substrate 130 On the other side of the first substrate...

no. 3 example

[0065] see image 3 , the silicon microphone system packaging structure 100 provided in this embodiment has the same basic structure, principle and technical effects as the first embodiment. For a brief description, the part not mentioned in this embodiment can refer to the first embodiment corresponding content.

[0066] The silicon wheat system packaging structure 100 includes a first substrate 110, a second substrate 130, a silicon wheat chip 150, a front cavity cover 170 and a rear cavity cover 190, the silicon wheat chip 150 is mounted on one side of the first substrate 110, and the front cavity cover 170 Mounted on the side of the first substrate 110 and covered outside the silicon wheat chip 150, the second substrate 130 is provided with a sound transmission groove 131, the first substrate 110 is mounted on the second substrate 130, and the rear chamber cover 190 mounted on the other side of the first substrate 110 . Wherein, the first substrate 110 covers the sound t...

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Abstract

Embodiments of the present invention provide a silicon microphone system packaging structure and a preparation method of a silicon microphone system packaging structure, which relate to the field of microphone packaging technology. The silicon microphone system packaging structure includes a first substrate, a second substrate, a silicon microphone chip, and a front cavity The cover and the rear cavity cover, by setting the sound transmission groove on the first substrate, the front cavity cover can be accommodated in the sound transmission groove, avoiding the direct stacking of the front cavity cover, thereby reducing the package height and package size, It is conducive to the miniaturization of products, and can prevent the problem of soldering failure caused by substrate warpage. At the same time, the external sound first enters the sound transmission groove through the first sound inlet hole, which prevents the external sound from directly contacting the silicon microphone chip, and avoids the impact of the sound pressure change on the silicon diaphragm and causes the silicon diaphragm to rupture. In addition, by setting the rear cavity cover, the air space behind the silicon microphone chip can be greatly expanded, thereby improving the sensitivity and signal-to-noise ratio of the silicon microphone, and at the same time improving the frequency response of the silicon microphone.

Description

technical field [0001] The invention relates to the technical field of microphone packaging, in particular to a silicon microphone system packaging structure and a method for preparing the silicon microphone system packaging structure. Background technique [0002] Microphones are important components in various electronic products. For example, electronic devices such as mobile phones and tablet computers need to be equipped with microphones. Among them, silicon microphones have been widely used in various electronic products due to their small size and stable signal. In order to realize the lightweight and miniaturization of electronic products such as mobile phones, packaging technology is required for silicon microphones in the prior art. The silicon microphone mainly includes a micro-electromechanical system chip, that is, a silicon microphone chip. The silicon microphone chip is usually provided with a silicon diaphragm and a silicon back plate. The pressure gradient ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R31/00H04R1/08
CPCH04R1/08H04R31/00H04R31/003
Inventor 何正鸿钟磊李利
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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