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Non-contact high-precision conformal fitting head for flexible curved surface electronic film

A non-contact, bonding head technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as poor bonding effect of conformal curved surfaces, damage to flexible electronic films, air bubbles, etc., to increase support points , improve fit, improve the effect of precision

Inactive Publication Date: 2020-04-21
荆门微田智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the lamination and transfer process of flexible electronic films is a difficult point in its production. Due to the rigidity of flexible electronic films manufactured on a plane, the lamination effect on conformal curved surfaces is often not good, and defects such as wrinkles and bubbles will appear.
This problem can be solved to a certain extent by mold deformation before lamination, but it is easy to damage the flexible electronic film when pressing and deforming the flexible electronic film

Method used

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  • Non-contact high-precision conformal fitting head for flexible curved surface electronic film
  • Non-contact high-precision conformal fitting head for flexible curved surface electronic film
  • Non-contact high-precision conformal fitting head for flexible curved surface electronic film

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Embodiment Construction

[0021] The present invention will be further described in conjunction with the following examples.

[0022] by Figure 1 to Figure 3 It can be seen that the non-contact high-precision conformal bonding head for a flexible curved electronic film according to this embodiment includes a base 1 and multiple sets of conformal bonding head components;

[0023] Each group of conformal laminating head assemblies includes a pull rod 2 passing through the base 1 and a driving member 11 for driving the pull rod 2 to rise and fall in the base 1; the driving member 11 is provided in the base 1; One end of the pull rod 2 is connected to the driving member 11; the other end of the pull rod 2 protrudes from one end of the base 1; each group of conformal bonding head assemblies also includes a sensor 31 provided at the other end of the base 1; the sensor 31 is electrically connected to the driving part 11;

[0024] An electrostatic adsorption film 4 is connected to the other end of the pull rod 2 p...

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Abstract

The invention relates to the technical field of flexible electronic films, in particular to a non-contact high-precision conformal fitting head for a flexible curved surface electronic film. The target curved surface is detected in a photoelectric non-contact manner, the target curved surface is prevented from being scratched by mechanical contact detection and a non-rigid curved surface can stillbe accurately detected. Conformal deformation is carried out before the flexible electronic film is pasted, the fitting degree of the flexible electronic film and the target curved surface is improved, and damage to the flexible electronic film in the fitting process is avoided. The supporting claws are arranged at the tail ends of pull rods, supporting points are increased without increasing thepull rods, and the curved surface simulation precision is improved.

Description

Background technique [0001] Flexible curved electronic film is a kind of integrated circuit that can be bent and pasted in conformity with the transfer method. It can be pasted on any curved surface to achieve corresponding electrical functions. Compared with traditional flat silicon-based electronic sensors, it is unparalleled Advantage. [0002] At present, the process of lamination and transfer printing of flexible electronic films is a difficult point in its production. Due to the rigidity of flat-manufactured flexible electronic films, the lamination effect on conformal curved surfaces is often poor, and defects such as wrinkles and bubbles may appear. This problem can be solved to a certain extent by the method of mold deformation before lamination, but it is easy to damage the flexible electronic film when the flexible electronic film is pressed and deformed. Summary of the invention [0003] The purpose of the present invention is to address the above-mentioned shortcoming...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00G01B11/14
CPCG01B11/14H05K3/0014H05K3/0058
Inventor 李紧英
Owner 荆门微田智能科技有限公司