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Dispensing process

A dispensing process and dispensing machine technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of unqualified chip loading, different chip overflow glue volume, small chip area, etc., and achieve the glue dispensing volume consistent effect

Inactive Publication Date: 2020-04-28
江阴苏阳电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the traditional role, Epoxy Adhesive Composition of conductive silver paste is mainly used to stick the chip on the carrier. Since the chip is becoming more and more precise and the area is getting smaller and smaller, the technology used in the traditional epoxy glue, the silver paste used with the The time after entering the operation room increases and the viscosity changes. If the dispensing operation method does not adjust the viscosity change caused by the time change of the silver paste in the operation room, the dispensing amount at the beginning of the operation is different from the point after a long time of operation. The amount of glue will obviously vary, which will lead to different amounts of glue overflowing on the chip. Now that the chip area is extremely small, such a difference in glue amount will easily lead to unqualified final loading.

Method used

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  • Dispensing process

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Embodiment Construction

[0020] The invention mainly aims at the chip loading process in the chip packaging process, and provides a glue dispensing process, which realizes time-controlled dispensing, and the glue output is consistent; mainly by controlling the working temperature of the conductive silver paste, the viscosity of the conductive silver paste is ensured , to achieve controllable glue output, the specific steps are as follows:

[0021] Step 1. Estimate the amount of glue used for one shift of 8 hours according to the production schedule. Take out an appropriate amount of conductive silver paste from the refrigerator in advance and put it in the operating room for waking up. The conductive silver paste bobbin is placed vertically with the glue outlet facing up.

[0022] In order to ensure the quality of conductive silver paste, the refrigerator storage temperature needs to be controlled at -40°C. If the amount of glue used per shift is large, it can be taken out of the refrigerator one by o...

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Abstract

The invention relates to a dispensing process, in particular, a dispensing process during chip mounting. A constant-temperature heater is used for carrying out constant-temperature heating control onthe tube of conductive silver paste, it is guaranteed that the temperature of the conductive silver paste is kept at 33-35 DEG C and is close to final working temperature 35 DEG C in a using process,it is guaranteed that the viscosity of the conductive silver paste is relatively consistent in a working process, and therefore, it is guaranteed that a dispensing amount is consistent in a dispensingoperation process. And meanwhile, by means of standardizing operation steps and process conditions, the stability of dispensing operation is ensured, the stability and reliability of chip mounting quality are finally ensured, and the rate of finished products is increased.

Description

technical field [0001] The invention relates to the chip packaging industry, in particular to a glue dispensing process during chip loading. Background technique [0002] With the development of science and technology, the electronic industry has advanced by leaps and bounds, the demand for various integrated and control circuits has increased rapidly, and the demand for chip packaging has also increased rapidly. [0003] Chip packaging refers to installing the precise semiconductor integrated circuit chip on the frame, then using the lead to connect the chip to the frame pins, and finally sealing the semiconductor integrated circuit chip with epoxy resin, and the outside world through the pins and the internal Chip for signal transmission. Packaging is mainly to seal the precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip will not be affected by external humidity and dust while it is functioning, and at the same time provide goo...

Claims

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Application Information

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IPC IPC(8): H01L21/50
CPCH01L21/50
Inventor 徐志华葛建秋王善国
Owner 江阴苏阳电子股份有限公司
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