Dispensing process
A dispensing process and dispensing machine technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of unqualified chip loading, different chip overflow glue volume, small chip area, etc., and achieve the glue dispensing volume consistent effect
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[0020] The invention mainly aims at the chip loading process in the chip packaging process, and provides a glue dispensing process, which realizes time-controlled dispensing, and the glue output is consistent; mainly by controlling the working temperature of the conductive silver paste, the viscosity of the conductive silver paste is ensured , to achieve controllable glue output, the specific steps are as follows:
[0021] Step 1. Estimate the amount of glue used for one shift of 8 hours according to the production schedule. Take out an appropriate amount of conductive silver paste from the refrigerator in advance and put it in the operating room for waking up. The conductive silver paste bobbin is placed vertically with the glue outlet facing up.
[0022] In order to ensure the quality of conductive silver paste, the refrigerator storage temperature needs to be controlled at -40°C. If the amount of glue used per shift is large, it can be taken out of the refrigerator one by o...
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