Glue dispensing process

Abstract

The invention discloses a glue dispensing process, mainly a glue dispensing process in chip loading. A constant-temperature heater is used for performing constant-temperature heating control on a cylinder tube of electric conducting silver pulp, so that the temperature of the electric conducting silver pulp in the use process is kept at 33-35 DEG C, and is near a final working temperature of 35 DEG C; and the viscosity of the electric conducting silver pulp in working is relatively constant, so that the glue dispensing quantity in the glue dispensing process is constant. Meanwhile, through standardization of operating steps and process conditions, the stability of the glue dispensing operation is guaranteed, the chip loading quality stability and reliability are finally guaranteed, and theyield is increased.

Description

technical field [0001] The invention relates to the chip packaging industry, in particular to a glue dispensing process during chip loading. Background technique [0002] With the development of science and technology, the electronic industry has advanced by leaps and bounds, the demand for various integrated and control circuits has increased rapidly, and the demand for chip packaging has also increased rapidly. [0003] Chip packaging refers to installing the precise semiconductor integrated circuit chip on the frame, then using the lead to connect the chip to the frame pins, and finally sealing the semiconductor integrated circuit chip with epoxy resin, and the outside world through the pins and the internal Chip for signal transmission. Packaging is mainly to seal the precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip will not be affected by external humidity and dust while it is functioning, and at the same time provide goo...

AI Technical Summary

Problems solved by technology

[0005] In the traditional role, Epoxy Adhesive Composition of conductive silver paste is mainly used to stick the chip on the carrier. Since the chip is becoming more and more precise and the area is getting smaller and smaller, the technology used in the traditional epoxy glue, the silver paste used with the The time after entering the operation room increases and the viscosity changes. If the dispensing operation method does not adjust the viscosity change caused by the time change of the silver paste in the operation room, the dispensing amount at the beginning of the operation is different from the point after a long time of operation. The amount of glue will obviously vary, which will lead to different amounts of glue overflowing on the chip. Now that the chip area is extremely small, such a difference in glue amount will easily lead to unqualified final loading.

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