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Liquid cooling head and liquid cooling type heat dissipation system

A liquid-cooled head and heat-dissipating unit technology, used in instruments, electrical digital data processing, electrical components, etc., can solve the problems of accelerating heat exchange, accelerating the collision of cooling fins, and turbulent manufacturing effects, so as to improve heat absorption. Efficiency, good heat dissipation effect

Active Publication Date: 2020-04-28
GIGA BYTE TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing cooling fins can be roughly columnar or sheet-shaped, and columnar cooling fins can disturb the flow direction of the cooling liquid to cause turbulent flow, so as to accelerate the collision between the cooling liquid and a plurality of the cooling fins, so as to accelerate heat exchange. Purpose, but there is a problem that the overall heat transfer area is small, which affects the heat absorption efficiency of the coolant
The overall heat conduction area of ​​thin-sheet heat dissipation fins is large, but there is a problem that the effect of turbulent flow is not good, which affects the heat absorption efficiency of the coolant
Therefore, there is still room for improvement in the heat absorption efficiency of the cooling liquid of the existing liquid cooling head

Method used

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  • Liquid cooling head and liquid cooling type heat dissipation system
  • Liquid cooling head and liquid cooling type heat dissipation system
  • Liquid cooling head and liquid cooling type heat dissipation system

Examples

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Embodiment Construction

[0072] figure 1 , figure 2 It is a three-dimensional appearance view and a three-dimensional exploded view of a preferred embodiment of the liquid cooling head of the present invention, which includes a heat conduction body 1 , a heat dissipation unit 2 , and a rotating device 3 . The heat-conducting body 1 can be made of heat-conducting metal, such as copper or aluminum, which has an inlet channel 101 for introducing cooling fluid (not shown in the figure), an outlet channel 102 for exporting cooling fluid, and connecting the inlet channel. The channel 101 and a heat exchange area 103 leading out of the flow channel 102 .

[0073] In this embodiment, for ease of assembly, as figure 2 As shown, the heat conducting body 1 includes a first block 11 , a second block 12 , and a third block 13 stacked in sequence. These blocks 11-13 are closely connected together by a plurality of bolt assemblies (not shown in the figure), and utilize the arrangement of a plurality of sealing ...

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Abstract

The invention mainly discloses a liquid cooling head. The liquid cooling head comprises a heat conduction body, a heat dissipation unit and a rotating device; the heat conduction body is provided witha leading-in flow channel used for leading in cooling liquid, a leading-out flow channel used for leading out the cooling liquid, and a heat exchange area connected with the leading-in flow channel and the leading-out flow channel; the heat dissipation unit is arranged in the heat exchange area of the heat conduction body; a rotary body of the rotating device is rotatably arranged in the heat conduction body and can rotate under the impact of the cooling liquid. Due to the fact that the rotating rotary body can disturb the flowing direction of the cooling liquid to cause turbulent flow, so that collision between the cooling liquid and the cooling fins of the heat dissipation unit can be increased, and therefore, heat exchange between the cooling liquid and the cooling fins is increased, and the heat absorption efficiency of the cooling liquid is improved.

Description

technical field [0001] The invention relates to a heat dissipation device for electronic components, in particular to a liquid cooling head used in a liquid cooling heat dissipation system Background technique [0002] With the highly dense wiring of integrated circuits and the substantial improvement in computing performance, the heat dissipation requirements of many electronic components such as central processing units are also increasing, so that the traditional air-cooled heat dissipation device no longer meets the heat dissipation requirements of some electronic components. , so as to solve the problem of the liquid-cooled heat dissipation system, which has a liquid-cooled circulation effect and can effectively dissipate heat for electronic components. [0003] The basic composition of the existing liquid-cooled heat dissipation system includes a liquid cooling head, a radiator and a pump. These three are connected to each other by pipelines to form a circulation loop,...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/433H01L23/473G06F1/20
CPCG06F1/20H01L23/367H01L23/433H01L23/473
Inventor 黄顺治毛黛娟靳丽艳郭春亮
Owner GIGA BYTE TECH CO LTD
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