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Cooling components and motherboard modules

A technology for heat dissipation components and motherboards, which is applied to digital data processing components, instruments, calculations, etc., and can solve problems such as space constraints of limited heat sources

Active Publication Date: 2021-05-11
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing water-cooled heat dissipation components are usually limited by the space of the heat source, and can only dissipate heat for a single heat source

Method used

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  • Cooling components and motherboard modules
  • Cooling components and motherboard modules
  • Cooling components and motherboard modules

Examples

Experimental program
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Embodiment Construction

[0049] figure 1 It is a schematic three-dimensional appearance diagram of a motherboard module according to an embodiment of the present invention. figure 2 Yes figure 1 A cross-sectional view of the motherboard module at section line A-A'. image 3 Yes figure 1 Schematic diagram of the explosion of the cooling assembly. It should be noted that, in order to clearly show the internal structure, figure 1 and figure 2 The housing 210 in is shown in phantom.

[0050] Please refer to Figure 1 to Figure 3 , an embodiment of the present invention includes a motherboard module 10 . The motherboard module 10 includes a motherboard 100, a heat dissipation component 200, and a first heat source 300 ( figure 2 ) and a second heat source 400 ( figure 2 ). In this embodiment, the first heat source 300 and the second heat source 400 are disposed on the motherboard 100 , and the heat dissipation component 200 is adapted to be connected to the motherboard to dissipate heat from ...

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Abstract

A heat dissipation assembly includes a casing and a partition structure. The casing includes a chamber, a first water hole and a second water hole, wherein the chamber includes a first area and a second area communicated with each other. The first water hole and the second water hole communicate with the first area. The partition structure includes a partition wall and a partition layer connected together, wherein the partition wall is vertically arranged in the first area to separate a first flow channel and a second flow channel arranged left and right in the first area. The partition layer is arranged horizontally in the second area to separate a third flow channel and a fourth flow channel arranged up and down in the second area.

Description

technical field [0001] The present invention relates to a heat dissipation assembly, and in particular, to a heat dissipation assembly applied to a motherboard module. Background technique [0002] Today's computer gamers focus on good computer performance, and high-performance computer components require higher power consumption. In the high-speed computing environment, the operating temperature of computer components with high power consumption increases accordingly, which affects the operating smoothness of the computer system. At present, the common heat dissipation method is to use water-cooled heat dissipation components. The heat dissipation components mainly absorb the heat energy of the heat source (such as the motherboard, central processing unit or display chip) through the liquid, and then discharge the heat-absorbing liquid for heat exchange cooling. cycle for cooling. Existing water-cooled heat dissipation components are usually limited by the space limitatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/184G06F1/20G06F2200/201
Inventor 黄顺治毛黛娟林宜臻
Owner GIGA BYTE TECH CO LTD