Liquid cooling case based on 3U-VPX and method

Abstract

The invention relates to the technical field of power supply heat dissipation and discloses a liquid cooling case based on 3U-VPX and a method, The liquid cooling case adopted by the method comprisesa cover plate, a left side plate, a right side plate, a front panel, a rear panel, a bottom plate and a TSF internal shunt connector, wherein the bottom plate is of a rectangular structure, a heat inlet exchange flow channel and a heat outlet exchange flow channel are formed in the positions, close to two side edges, of the bottom plate of the rectangular structure, the heat inlet exchange flow channel is parallel to the heat outlet exchange flow channel, the heat inlet exchange flow channel and the heat outlet exchange flow channel are communicated through a plurality of TSF internal shunt connectors to form a liquid cooling heat exchange confluence channel of the liquid cooling case, one end of the heat inlet exchange flow channel on the bottom plate is communicated with a TSA outer fluid connector, and one end of the outlet heat exchange flow channel on the bottom plate is communicated with the TSA external fluid connector. The liquid cooling case is advantaged in that through the liquid cooling heat dissipation technology, the heat dissipation capacity is high, the liquid supply requirement for heat dissipation and cooling of the high-power power supply can be met, the heat dissipation capacity of the power supply is remarkably improved, the power of the power supply is higher, and the wide application prospect is achieved.

Description

technical field [0001] The invention relates to the technical field of power supply cooling, and relates to a chassis, in particular to a 3U-VPX liquid-cooled chassis and method. Background technique [0002] With the development of miniaturization of power modules, the heat density of the modules is getting higher and higher. Traditional power cooling methods mostly use conduction cooling and air cooling to dissipate heat. The heat dissipation capacity is limited, so the output power of the power supply is limited. In addition, the demand for high-power 3U-VPX power supply is also increasing, and the demand for the corresponding chassis is also increasing. Contents of the invention [0003] In view of the above technical problems, the purpose of the present invention is to provide a 3U-VPX liquid-cooled chassis and method, which can significantly improve the heat dissipation capacity of the power supply through liquid cooling and heat dissipation technology, so that the p...

AI Technical Summary

Problems solved by technology

[0002] With the development of miniaturization of power modules, the heat density of the modules is getting bigger and bigger. Traditional power cooling methods mostly adopt conduction cooling and air cooling, and the cooling capacity is limited, so the output power of the power supply is limited.

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