Server, mainboard and CPU mounting and fixing reinforcing module

Abstract

The invention discloses a CPU mounting and fixing reinforcing module. The module comprises a PCB, a CPU slot, a CPU mounted in the CPU slot, a mounting lining plate arranged on the surface of the PCBand distributed around the CPU slot, a mounting back plate arranged on the back surface of the PCB, and a heat radiator shell mounted on the surface of the mounting lining plate and tightly pressed onthe surface of a CPU, an elastic plate capable of deforming in the vertical direction is arranged on the surface of the installation lining plate, the two ends of the elastic plate are connected withthe installation lining plate through first connecting pieces, and the installation lining plate and the installation back plate are tensioned through the first connecting pieces. A second connectingpiece is arranged on the elastic plate, and a pre-tightening adjusting piece used for being matching the second connecting piece and enabling the elastic plate to generate elastic deformation so as to tighten the radiator shell is arranged on the radiator shell. The structure of the CPU mounting module can be simplified, the dismounting and mounting efficiency is improved, the pressing force on the CPU is enhanced, and the heat dissipation performance and good physical contact are guaranteed. The invention also discloses a mainboard and a server, which have the above beneficial effects.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a CPU installation and fixing strengthening module. The invention also relates to a motherboard and a server. Background technique [0002] With the development of electronic technology in China, more and more electronic devices have been widely used. [0003] A server is an important part of electronic equipment and a device that provides computing services. Since the server needs to respond to and process service requests, generally speaking, the server should have the ability to undertake and guarantee services. In the era of Internet, big data and cloud computing, higher requirements are put forward for the transmission and processing speed, storage capacity and high-performance computing capacity of massive data. Due to the impact of intensive computing, higher requirements are placed on the processing capacity of the server. [0004] One of the current ways is to increa...

AI Technical Summary

Problems solved by technology

[0005] The structure of the CPU installation module in the prior art is complicated, and there are many installation process steps. It is troublesome to disassemble and assemble the CPU module on the motherboard. The increased total pressure load demand leads to insufficient bonding between the radiator and the CPU. On the one hand, it cannot ensure that the CPU has sufficient heat dissipation capacity; on the other hand, there is a risk of poor physical contact between the CPU pins and the CPU socket.

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