9 results about "CPU socket" patented technology

The utility model discloses a rotatable CPU water cooling head quick detach buckle structure, including water cooling head main part, buckle support and rotation positioning assembly, the buckle support is connected with water cooling head main part through the rotation cover, and the rotation cover is coaxial with water cooling head main part and is arranged, so that the buckle support can rotate around the axis of water cooling head main part. Spring steel elastic card arm, cooperation limit boss and antiskid line can be operated by one hand without tools, and the installation time is greatly shortened, and convenience and durability are compatible. The rotation positioning assembly is steppedly matched through the V-shaped tooth groove and the clamping block, and is combined with the angle mark and the auxiliary positioning column, so that the installation angle error is low, different CPU socket spacings are adapted, and the multi-platform compatibility is improved. The stepped shaft rotation cover eliminates the axial movement, and the torsional stiffness is enhanced. The silica gel buffer pad and spring steel card arm avoid the fan vibration frequency band, and reduce the overall vibration.

The invention relates to the technical field of electronic component detection, in particular to a CPU socket pin detection method and system based on machine vision. The method comprises the following steps: acquiring an orthographic projection image of a CPU socket pin, extracting coordinate data of a key vertex, and forming a pixel-level vertex coordinate array, namely a pin vertex pixel set; wherein the key vertex comprises a pin end point and a bending point; according to the distribution condition of the pin vertex pixel set and the multi-dimensional characteristic parameters, judging pin defects of the CPU socket pins, and outputting defect data; defect data are obtained, multi-level early warning levels are divided according to defect types and parameter deviation degrees, differential response mechanisms are matched, and a traceable detection report is generated; the system comprises a pin vertex pixel set acquisition module, a pin defect judgment module and a detection grading early warning module. Through the above mode, accurate judgment based on pin vertex features and defects is realized, graded early warning is carried out, and refined management and control of the production process are facilitated.

To provide an AI system that enables fast and efficient communication between multi-node accelerator systems and server systems, does not require explicit software activation, and provides a guaranteed delivery scheme. [Solution] An AI system uses transparent bridging to transfer data between AI accelerator devices over an intra-node or inter-node network. The invention configures a source device to transfer data assuming that the transfer protocol guarantees delivery of the data to the destination device. The receiver does not need to know the identity of the sender that transferred the data or when the data was transferred. Transparent bridging technology can be implemented using input / output (IO) streaming devices connected to switches or CPU sockets on both the source and destination devices.

The invention discloses an anti-warping CPU socket containing fluorinated silicone rubber and a manufacturing method of the anti-warping CPU socket. The anti-warping CPU socket containing the fluorinated silicone rubber comprises an insulating seat, and the insulating seat comprises the following raw materials in percentage by mass: 60%-85% of LCP; 15%-35% of fluorinated silicone rubber; 3%-6% of a silane coupling agent; 0.3%-1% of an antioxidant aid; 0-3% of other additives; the sum of the raw materials is 100%. The main components of the insulating seat of the anti-warping CPU socket are LCP and fluorinated silicone rubber, the anti-warping capability of the insulating seat can be enhanced by adding the fluorinated silicone rubber, the overall flatness of the CPU socket is high, the anti-static performance is good, and the deformation capability of the CPU socket is improved, so that the fitting degree of the CPU socket and a PCB can be improved when the CPU socket is welded with the PCB, and the service life of the CPU socket is prolonged. The phenomenon of pseudo soldering or solder joint separation between the CPU socket and the PCB is avoided, and the product quality is ensured.

A method and system for transferring data between AI accelerator devices across an intranode network or an internode network using transparent bridging. The present techniques configure a source device to transfer data while assuming the transfer protocol guarantees delivery of the data to a destination device. The receiver does not need to know the identity of the sender that transferred the data or when the data has been transferred. The transparent bridging techniques can be implemented using input / output (IO) streaming devices coupled to switches or CPU sockets of both the source and destination devices. Such techniques can enable fast and efficient communications across multi-node accelerator systems and server systems. Further, explicit software enablement is not required, and a guaranteed delivery scheme can be used as well.

Apparatuses for characterizing system channels and associated methods and systems are disclosed. In one embodiment, a tester is coupled to an adapter configured to be inserted into a CPU socket of a system platform, such as a motherboard. The motherboard includes a memory socket connected to the CPU socket by a system channel. The adapter can include a connector configured to physically and electrically engage with the CPU socket, an interface configured to receive test signals from the tester, and circuitry configured to internally route the test signals to the connector. The adapter, when inserted into the CPU socket, can facilitate the tester directly evaluating signal transfer characteristics of the system channel. Accordingly, the tester can determine optimal operating parameters for a memory device in view of the system channel characteristics.

The utility model discloses a computer mainboard slot protection device which comprises a circuit board, a graphics card slot protection assembly is fixed on the front side of the surface of the top of the circuit board, and a memory bank slot protection assembly is fixed on the right side of the surface of the top of the circuit board. In the graphics card slot protection assembly, a rectangular metal frame is arranged at the bottom of an outer ring of a graphics card slot, and a plurality of L-shaped supporting strips are fixed on the outer surface of the rectangular metal frame in a linear array to provide stable support for the graphics card slot and prevent pins from shifting or falling off when the graphics card is pulled and inserted. In the memory bank slot protection assembly, a U-shaped frame is arranged outside the memory bank slot, two rubber closing sheets are symmetrically arranged at a top port of the U-shaped frame, and the U-shaped frame is connected with the frame through an arc-shaped elastic traction strip, so that the memory bank is opened when being inserted, and is closed and sealed when being pulled out. In addition, the circuit board is further provided with a CPU socket and various interface slots, and diversified requirements are met.

The invention discloses a low-warpage LCP composite material containing fluorinated silicone rubber and a CPU socket made of the low-warpage LCP composite material. The low-warpage LCP composite material comprises the following raw materials in percentage by mass: 60%-85% of LCP; 15%-35% of fluorinated silicone rubber; 4%-8% of a silane coupling agent; the sum of the raw materials is 100%. The preparation method comprises the following steps: weighing the raw material components in percentage by mass, and respectively drying the LCP and the fluorinated silicone rubber; and then putting all the raw materials into a double-screw extruder, and carrying out blending, extruding and pelletizing through the double-screw extruder to form the low-warpage LCP composite material. The main components of the insulating base of the CPU socket are LCP and fluorinated silicone rubber, the warping resistance of the insulating base can be enhanced by adding the fluorinated silicone rubber, the overall flatness of the CPU socket is high, the anti-static performance is good, the deformation capacity of the CPU socket is improved, the fitting degree of the CPU socket and a PCB can be improved when the CPU socket is welded to the PCB, and the service life of the CPU socket is prolonged. And the phenomenon of pseudo soldering or solder joint separation between the CPU socket and the PCB is avoided.

The invention discloses an anti-warping CPU socket based on a stress buffer fluorinated silicone rubber layer, which comprises an insulating base and a plurality of terminals mounted on the insulating base, a fluorinated silicone rubber layer is further fixed on the bottom surface of the insulating base, the insulating base is in contact with a PCB (printed circuit board) through the fluorinated silicone rubber layer, and after the insulating base is fixedly connected with the PCB, the terminal is fixed on the insulating base through the fluorinated silicone rubber layer. The fluorinated silicone rubber layer is extruded to deform so as to form joint gapless contact with the PCB, so that the joint between the bottom surface of the CPU socket and the PCB is smoother, the phenomenon of pseudo soldering or poor contact between the terminals in the CPU socket and the PCB is avoided, the conduction quality is ensured, and the service life of the CPU socket is prolonged. And after welding, the phenomenon that the CPU socket is separated from a welding spot of the PCB due to warping of the CPU socket in the later period is basically avoided, or the limitation that the terminal in the CPU socket is separated from the PCB due to warping of the CPU socket in the later period after the terminal in the CPU socket is in elastic contact with the PCB is avoided, and the product quality is ensured.