19 results about "CPU socket" patented technology

Embodiments described herein are generally directed to selective multithreaded execution of memory training by CPU sockets. In an example, a memory configuration and a current phase of execution of memory training for each of multiple CPU sockets of a computer system is received. Based on the memory configuration and the current phase of execution of each of the CPU sockets an estimated power usage across all CPU sockets may be determined. Based on the estimated power usage and a power consumption threshold (e.g., PTAM or PA), performance of the current phase of execution of one or more CPU sockets may be selectively released for one or more channels of the one or more CPU sockets.

The utility model discloses a rotatable CPU water cooling head quick detach buckle structure, including water cooling head main part, buckle support and rotation positioning assembly, the buckle support is connected with water cooling head main part through the rotation cover, and the rotation cover is coaxial with water cooling head main part and is arranged, so that the buckle support can rotate around the axis of water cooling head main part. Spring steel elastic card arm, cooperation limit boss and antiskid line can be operated by one hand without tools, and the installation time is greatly shortened, and convenience and durability are compatible. The rotation positioning assembly is steppedly matched through the V-shaped tooth groove and the clamping block, and is combined with the angle mark and the auxiliary positioning column, so that the installation angle error is low, different CPU socket spacings are adapted, and the multi-platform compatibility is improved. The stepped shaft rotation cover eliminates the axial movement, and the torsional stiffness is enhanced. The silica gel buffer pad and spring steel card arm avoid the fan vibration frequency band, and reduce the overall vibration.

The application discloses a copper-nickel-cobalt-silicon alloy for CPU sockets and a preparation method thereof, and belongs to the technical field of copper alloy materials. The alloy comprises the following components in percentage by mass: Ni 2.3-4.6%, Co 0.1-0.8%, Si 0.6-1.3%, and one or more elements (content 0.1-0.8%) selected from Zn, Sn, Mg, Mn, Fe, Ti and Cr, the balance being Cu and inevitable impurities, and satisfying (Ni+Co) / Si=3-5. The alloy strip with a thickness of 0.03-0.4 mm and a width of greater than or equal to 580 mm is prepared by optimizing the distribution of precipitated phase (Ni,Co)2Si and combining a multi-stage rolling and annealing process (including melting, hot rolling, cold rolling, recrystallization annealing, aging annealing and the like). The application significantly reduces the material cost by reducing the use of Co, which is an expensive strategic resource. Reducing the amount of Co not only improves the performance-price ratio of the material, but also reduces the production cost, and the energy consumption and material cost are significantly reduced.

A CPU socket contact having a CPU socket contact body that improves bandwidth throughput facilitates high-speed data transmission through a CPU socket. The CPU socket contact body partially depends from the CPU socket contact and may include a cavity. The CPU socket contact body includes a capacitive impedance that substantially cancels the inductive impedance of the CPU socket contact. This cancellation of the inductive impedance causes the CPU socket contact to operate like an impedance-matched coaxial transmission line, enabling better bandwidth throughput than a non-impedance-matched transmission line.

The invention relates to the technical field of electronic component detection, in particular to a CPU socket pin detection method and system based on machine vision. The method comprises the following steps: acquiring an orthographic projection image of a CPU socket pin, extracting coordinate data of a key vertex, and forming a pixel-level vertex coordinate array, namely a pin vertex pixel set; wherein the key vertex comprises a pin end point and a bending point; according to the distribution condition of the pin vertex pixel set and the multi-dimensional characteristic parameters, judging pin defects of the CPU socket pins, and outputting defect data; defect data are obtained, multi-level early warning levels are divided according to defect types and parameter deviation degrees, differential response mechanisms are matched, and a traceable detection report is generated; the system comprises a pin vertex pixel set acquisition module, a pin defect judgment module and a detection grading early warning module. Through the above mode, accurate judgment based on pin vertex features and defects is realized, graded early warning is carried out, and refined management and control of the production process are facilitated.

The invention provides a pin type industrial computer mainboard with a misplug prevention function, and relates to the field of industrial computer mainboards. A CPU socket is arranged at the left part of the top end surface of the PCB substrate main body; a power interface is arranged at the left part of the top end surface of the PCB substrate main body; a plurality of groups of SATA interfaces are arranged at the left lower part of the top end surface of the PCB substrate main body; a plurality of groups of all-solid-state capacitors are arranged on the top end surface of the PCB substrate main body; the lower part of the PCB substrate main body is fixedly connected with a first wire holder; the rear end face of the first wire holder is symmetrically and fixedly connected with two groups of first fixing seats. When wiring is carried out, the control swing frames at different positions can be pushed, so that the control swing frames are turned over to clamp different cables, and the problem that when field personnel operate an industrial computer, accidental pulling force is generated on the cables due to unintentional touch or dragging, and consequently the cables connected with a mainboard interface are loosened is solved.

The utility model relates to the technical field of electronic maintenance welding, in particular to a server CPU socket maintenance anti-deformation jig which comprises a front pressing plate and a back pressing plate. A connecting piece is arranged between the front pressure plate and the back pressure plate, the middle of the front pressure plate and the middle of the back pressure plate are each provided with a chip containing groove of a quasi-rectangular structure, the chip containing grooves correspond to the chip circuit board in position, and a containing frame of a rectangular structure is installed in the middle of the chip containing groove in the back pressure plate. Diagonal ribs are connected between the outer right-angle position of the containing groove and the inner wall of the chip containing groove, middle ribs are connected between the long straight face of the containing groove and the inner wall of the chip containing groove, and the containing frame is separated by the diagonal ribs and the middle ribs. The jig is simple in structure and convenient to assemble and disassemble, and can be used for safely and accurately positioning and maintaining the circuit board chip.

To provide an AI system that enables fast and efficient communication between multi-node accelerator systems and server systems, does not require explicit software activation, and provides a guaranteed delivery scheme. [Solution] An AI system uses transparent bridging to transfer data between AI accelerator devices over an intra-node or inter-node network. The invention configures a source device to transfer data assuming that the transfer protocol guarantees delivery of the data to the destination device. The receiver does not need to know the identity of the sender that transferred the data or when the data was transferred. Transparent bridging technology can be implemented using input / output (IO) streaming devices connected to switches or CPU sockets on both the source and destination devices.

The invention discloses an anti-warping CPU socket containing fluorinated silicone rubber and a manufacturing method of the anti-warping CPU socket. The anti-warping CPU socket containing the fluorinated silicone rubber comprises an insulating seat, and the insulating seat comprises the following raw materials in percentage by mass: 60%-85% of LCP; 15%-35% of fluorinated silicone rubber; 3%-6% of a silane coupling agent; 0.3%-1% of an antioxidant aid; 0-3% of other additives; the sum of the raw materials is 100%. The main components of the insulating seat of the anti-warping CPU socket are LCP and fluorinated silicone rubber, the anti-warping capability of the insulating seat can be enhanced by adding the fluorinated silicone rubber, the overall flatness of the CPU socket is high, the anti-static performance is good, and the deformation capability of the CPU socket is improved, so that the fitting degree of the CPU socket and a PCB can be improved when the CPU socket is welded with the PCB, and the service life of the CPU socket is prolonged. The phenomenon of pseudo soldering or solder joint separation between the CPU socket and the PCB is avoided, and the product quality is ensured.

A method and system for transferring data between AI accelerator devices across an intranode network or an internode network using transparent bridging. The present techniques configure a source device to transfer data while assuming the transfer protocol guarantees delivery of the data to a destination device. The receiver does not need to know the identity of the sender that transferred the data or when the data has been transferred. The transparent bridging techniques can be implemented using input / output (IO) streaming devices coupled to switches or CPU sockets of both the source and destination devices. Such techniques can enable fast and efficient communications across multi-node accelerator systems and server systems. Further, explicit software enablement is not required, and a guaranteed delivery scheme can be used as well.

The invention discloses a copper-nickel-cobalt-silicon alloy for a CPU Socket and a preparation method of the copper-nickel-cobalt-silicon alloy, and belongs to the technical field of copper alloy materials. The alloy comprises the following components in percentage by mass: 2.3-4.6% of Ni, 0.1-0.8% of Co, 0.6-1.3% of Si, one or more elements (with the content of 0.1-0.8%) selected from Zn, Sn, Mg, Mn, Fe, Ti and Cr, and the balance of Cu and inevitable impurities, the ratio of (Ni + Co) to Si is 3-5, and by optimizing the distribution of a precipitated phase (Ni, Co) 2Si and combining a multi-stage rolling and annealing process (including fusion casting, hot rolling, cold rolling, recrystallization annealing, aging annealing and the like), the alloy can be prepared into the high-strength and high-toughness alloy. The thickness of the alloy strip ranges from 0.03 mm to 0.4 mm, and the width of the alloy strip is larger than or equal to 580 mm. According to the invention, the material cost is obviously reduced by reducing the use amount of Co, and Co is an expensive strategic resource, so that the cost performance of the material is improved, the production cost is also reduced, and the energy consumption and the material cost are obviously reduced.

An exemplary multi-socket system and method are disclosed for employing a memory pool configured with memory resources accessible to every core, at CPU sockets, of every multi-CPU-socket chassis in the system. The exemplary system can migrate, via one or more computer express links (CXL), heavily shared memory resources (e.g., vagabond pages) from a specific multi-CPU-socket chassis to the memory pool, where every core can access the shared memory resources in quick single-hop accesses, thereby mitigating performance bottlenecks caused by slow multi-hop memory accesses to the same memory resources.

In one embodiment, a printed circuit board (PCB) has a first central processing unit (CPU) socket and a second CPU socket that is substantially aligned with the first CPU socket, and also has a first plurality of dual in-line memory module (DIMM) sockets interconnected with the first CPU socket and a second plurality of DIMM sockets (in a direction parallel to the first plurality of DIMM sockets) interconnected with the second CPU socket. The first plurality of DIMM sockets are arranged in at least a first column of DIMM sockets and a second column of DIMM sockets on the PCB, and the second plurality of DIMM sockets are arranged in at least the second column of DIMM sockets and a third column of DIMM sockets on the PCB such that the second column of DIMM sockets contains interleaved DIMM sockets from each of the first plurality of DIMM sockets and the second plurality of DIMM sockets.

Apparatuses for characterizing system channels and associated methods and systems are disclosed. In one embodiment, a tester is coupled to an adapter configured to be inserted into a CPU socket of a system platform, such as a motherboard. The motherboard includes a memory socket connected to the CPU socket by a system channel. The adapter can include a connector configured to physically and electrically engage with the CPU socket, an interface configured to receive test signals from the tester, and circuitry configured to internally route the test signals to the connector. The adapter, when inserted into the CPU socket, can facilitate the tester directly evaluating signal transfer characteristics of the system channel. Accordingly, the tester can determine optimal operating parameters for a memory device in view of the system channel characteristics.

The present invention relates to the technical field of EEB motherboards and provides a heat-dissipation-improved EEB motherboard used as a chassis component, and a routing method. The EEB motherboard comprises: a PCB provided with a first extension portion and a second extension portion; a first CPU socket diposed on the PCB and located at the lower left of the PCB; a second CPU socket disposed on the PCB and located at the lower right of the PCB; a first power module located directly below the first CPU socket; a second power module located directly below the second CPU socket; a first memory slot group disposed on the PCB and located on left and right sides of the first CPU socket; a second memory slot group disposed on the PCB and located on left and right sides of the second CPU socket; a PCIE slot group located above the PCB; a first PCIE expansion interface disposed on the PCB; a second PCIE expansion interface disposed on the PCB; a PCH disposed on the PCB; and four MCIO connectors disposed on the PCB and the first extension portion. The present invention has the advantages: under the premise of ensuring compatibility, it greatly improves the heat dissipation performance, signal stability and expandability of the EEB motherboard.

The utility model discloses a computer mainboard slot protection device which comprises a circuit board, a graphics card slot protection assembly is fixed on the front side of the surface of the top of the circuit board, and a memory bank slot protection assembly is fixed on the right side of the surface of the top of the circuit board. In the graphics card slot protection assembly, a rectangular metal frame is arranged at the bottom of an outer ring of a graphics card slot, and a plurality of L-shaped supporting strips are fixed on the outer surface of the rectangular metal frame in a linear array to provide stable support for the graphics card slot and prevent pins from shifting or falling off when the graphics card is pulled and inserted. In the memory bank slot protection assembly, a U-shaped frame is arranged outside the memory bank slot, two rubber closing sheets are symmetrically arranged at a top port of the U-shaped frame, and the U-shaped frame is connected with the frame through an arc-shaped elastic traction strip, so that the memory bank is opened when being inserted, and is closed and sealed when being pulled out. In addition, the circuit board is further provided with a CPU socket and various interface slots, and diversified requirements are met.

The invention discloses a low-warpage LCP composite material containing fluorinated silicone rubber and a CPU socket made of the low-warpage LCP composite material. The low-warpage LCP composite material comprises the following raw materials in percentage by mass: 60%-85% of LCP; 15%-35% of fluorinated silicone rubber; 4%-8% of a silane coupling agent; the sum of the raw materials is 100%. The preparation method comprises the following steps: weighing the raw material components in percentage by mass, and respectively drying the LCP and the fluorinated silicone rubber; and then putting all the raw materials into a double-screw extruder, and carrying out blending, extruding and pelletizing through the double-screw extruder to form the low-warpage LCP composite material. The main components of the insulating base of the CPU socket are LCP and fluorinated silicone rubber, the warping resistance of the insulating base can be enhanced by adding the fluorinated silicone rubber, the overall flatness of the CPU socket is high, the anti-static performance is good, the deformation capacity of the CPU socket is improved, the fitting degree of the CPU socket and a PCB can be improved when the CPU socket is welded to the PCB, and the service life of the CPU socket is prolonged. And the phenomenon of pseudo soldering or solder joint separation between the CPU socket and the PCB is avoided.

The application discloses a CPU Socket high-speed pin equipment and belongs to the technical field of chip processing. The CPU Socket high-speed pin equipment comprises a rack, a protective cover arranged on the rack, a terminal feeding and detecting mechanism, a defective product removing mechanism and a material belt moving structure. The defective product removing mechanism is arranged above the terminal feeding and detecting mechanism, and the material belt moving structure is arranged at the discharging end of the terminal feeding and detecting mechanism. Cam pin mechanisms are arranged on the rack and are arranged between the defective product removing mechanism and the material belt moving structure. A support, a glue core feeding assembly, a glue core hole blocking detection and glue core first pin position reference positioning assembly, a glue core hole blocking detection and glue core first pin position reference positioning assembly, a glue core moving and size compensating assembly, a pin rotating assembly and a product discharging assembly are arranged on the rack. A discharging carrying structure and a discharging bearing structure are further arranged on the rack. The CPU Socket high-speed pin equipment can automatically insert terminals into glue cores, and the working efficiency is improved.

The invention discloses an anti-warping CPU socket based on a stress buffer fluorinated silicone rubber layer, which comprises an insulating base and a plurality of terminals mounted on the insulating base, a fluorinated silicone rubber layer is further fixed on the bottom surface of the insulating base, the insulating base is in contact with a PCB (printed circuit board) through the fluorinated silicone rubber layer, and after the insulating base is fixedly connected with the PCB, the terminal is fixed on the insulating base through the fluorinated silicone rubber layer. The fluorinated silicone rubber layer is extruded to deform so as to form joint gapless contact with the PCB, so that the joint between the bottom surface of the CPU socket and the PCB is smoother, the phenomenon of pseudo soldering or poor contact between the terminals in the CPU socket and the PCB is avoided, the conduction quality is ensured, and the service life of the CPU socket is prolonged. And after welding, the phenomenon that the CPU socket is separated from a welding spot of the PCB due to warping of the CPU socket in the later period is basically avoided, or the limitation that the terminal in the CPU socket is separated from the PCB due to warping of the CPU socket in the later period after the terminal in the CPU socket is in elastic contact with the PCB is avoided, and the product quality is ensured.