293 results about "CPU socket" patented technology

A USB electronic cigarette has an atomizer section. The atomizer section has a heat chamber configured to receive liquid from a fluid reservoir. A USB connector is formed on the atomizer section. The USB connector includes a USB socket mounted to the atomizer section. A battery section is releasable and detachable from the atomizer section at the USB connector. The USB connector includes a USB protrusion configured to fit into the USB socket. The USB protrusion is mounted to the battery section. A rechargeable battery is housed within the battery section and configured to be recharged via the USB protrusion. A user is provided a smokable USB stick that is USB rechargeable.

A computer motherboard includes first and second peripheral interfaces, a switching interface, a switching card inserted into the switching card, and first and second central processing unit (CPU) sockets. The switching interface is placed between the first and second peripheral interfaces. The switching card includes first and second interface. Pins of the first interface of the switching card are interconnected, and pins of the second interface of the switching card are interconnected. Connection between the first and second peripheral sockets and the first and second CPU sockets is adjustable by selectively connecting one of the first and second interfaces of the switching card to the switching interface.

Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing component. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.

Embodiments of both a non-volatile main memory (NVMM) single node and a multi-node computing system are disclosed. One embodiment of the NVMM single node system has a cache subsystem composed of all DRAM, a large main memory subsystem of all NAND flash, and provides different address-mapping policies for each software application. The NVMM memory controller provides high, sustained bandwidths for client processor requests, by managing the DRAM cache as a large, highly banked system with multiple ranks and multiple DRAM channels, and large cache blocks to accommodate large NAND flash pages. Multi-node systems organize the NVMM single nodes in a large inter-connected cache/flash main memory low-latency network. The entire interconnected flash system exports a single address space to the client processors and, like a unified cache, the flash system is shared in a way that can be divided unevenly among its client processors: client processors that need more memory resources receive it at the expense of processors that need less storage. Multi-node systems have numerous configurations, from board-area networks, to multi-board networks, and all nodes are connected in various Moore graph topologies. Overall, the disclosed memory architecture dissipates less power per GB than traditional DRAM architectures, uses an extremely large solid-state capacity of a terabyte or more of main memory per CPU socket, with a cost-per-bit approaching that of NAND flash memory, and performance approaching that of an all DRAM system.

Provided a clip set (50) for pressing a CPU toward LGA contacts of a CPU socket comprises, a rigid body having an elongate base (501) with upper and lower edges. A set of first pressing finger (502) extends from the upper edge traversally and away from the base. Each of the first pressing fingers includes a first pressing pad located at a first plane. A set of second pressing finger (503) extends from and away from the base, and includes a second pressing pad located at a second plane differential to the first plane. The set of first and second pressing fingers are dimensioned to be located in two different levels so as to assert downward pressure to a die (302) of the CPU and a substrate (301) of the CPU, respectively.

The invention discloses a method and a device for realizing OTG based on a UBS socket. The device comprises a first channel, an overvoltage detection circuit, a second channel, an automatic master-slave switching circuit and a slave state holding circuit, wherein the first channel is used for supplying electricity to external equipment; the overvoltage detection circuit is used for detecting the voltage state on the channel of the external equipment; the second channel is used for controlling state switching according to a received detection result sent by the overvoltage detection circuit and outputting corresponding signals to a processor; the automatic master-slave switching circuit controls the processor which is connected with the automatic master-slave switching circuit to switch to the slave state according to the slave state signal, and cuts off the first channel for supplying the electricity to the external equipment through the processor, or controls the processor which is connected with the automatic master-slave switching circuit to switch to the master state according to the master state signal; and the slave state holding circuit enables the second channel to keep on state according to the slave state signal of the processor. By successfully adopting effective combination of a passive device and a voltage standard, the method and the device realize the automatic switching of an ID state and effectively avoid the phenomenon that similar states collide.

A modularized motherboard is provided. The modularized motherboard includes a first circuit board, a second circuit board and a connecting device. The first circuit board includes a north bridge chip, a central processing unit (CPU) slot and a first connecting port. The CPU slot is coupled to the north bridge chip and is used for installing a CPU. The second circuit board is independent of the first circuit board. The second circuit board includes a second connecting port and a south bridge chip. The south bridge chip is coupled to the north bridge chip via the second connecting port the first connecting port. The connecting device is coupled between the first connecting port and the second connecting port.

An electrical connector assembly comprises a central processing unit (CPU), a plurality of cable connectors soldered on the CPU and a CPU socket for electrical connecting the CPU to a printed circuit board (PCB). Each cable connector includes a base having a plurality of first terminals received therein, for contacting with conductive points of the cable. The CPU socket includes an insulating housing having a plurality of second terminals received therein and a loading mechanism attached to the insulating housing. The loading mechanism can simultaneously pressing the cables against the cable connectors and the CPU toward the CPU socket for electrically connecting the CPU with the cables and the PCB.

The invention provides a connection test method of a motherboard CPU (Central Processing Unit) slot based on boundary scan, which comprises the following steps of analyzing a to-be-tested motherboard schematic diagram and a boundary scan description language file of a motherboard CPU, a virtual DIMM (dual In-line memory module) jig and a virtual PCIE jig, and extracting scan chain information of the to-be-tested motherboard; extracting scan unit information corresponding to a to-be-tested motherboard CPU slot connecting line; a to-be-tested motherboard CPU, the virtual DIMM jig and the virtual PCIE jig are controlled on a test control motherboard through a TAP controller to enter a boundary scan mode; running multiple types of boundary scan child tests, and collecting and analyzing a responding result; judging whether the to-be-tested motherboard is fault or not and locating the fault position according to the responding result. According to a connection test device and the method, a CPU signal transfer jig is no need to be designed and manufactured, although the virtual DIMM jig and the virtual PCIE jig are needed to be used, the design and the manufacturing process are both simple. Outage for switching hardware in the testing process is not needed. Once the inserting connection of the hardware is finished, all tests can be completed at one time.

The invention provides a connector which is easily manufactured and connects a circuit board in good condition. The connector according to the invention is a CPU socket to be surface-mounted on a circuit board 2, comprising a terminal 5 attached inside an internal case 4a made of an insulating material and a solder 6 fixed to the terminal 5. A connecting section 11 of the terminal 5 is provided with a pair of bar-like pieces 12, and has first claw sections 13 and a second claw section 14. In order to fix the solder 6 to the connecting section 11, tip ends of the first claw sections 13 are caulked by bending so that the tip ends contact with each other. The connecting section 11 is provided with an internal passage 15 connecting the upper and lower sides thereof. The solder 6 does not come off the terminal 5 because the solder 6 is attached to the internal case 4a after fixed to the connecting section 11 of the terminal 5 by caulking. In addition, it is easy to improve coplanarity of the tip end of each solder 6 because a length of the solder 6 protruding from the connecting section 11 is adjustable by changing the caulking position of the solder 6.

A conductive contact (200) for electrically connecting with a chip module and a printed circuit board comprises a base portion (50), a top head portion (60) formed above the base portion adapted for connecting with a belt, at least one spring arm (70) extending sidewardly from the base portion and forming at least one contacting section (703) adapted for elastically contacting with the chip module, and a bottom soldering portion (80) extending form at least one of the base portion and the spring arm adapted for being soldered to the printed circuit board. The head portion defines a cutout (601) recessed downwardly from a top edge (602) thereof to reduce connecting length between the head portion and the belt and reduce siphonic effect when plating the spring arm.

A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.

A multifunctional USB flash drive organizer includes a main unit, an interior of which is provided with a containing chamber to put USB flash drives. A side of the containing chamber is pivoted with USB sockets which can turn and a wire containing slot is provided beside the containing chamber. The main unit is provided with a wire collection device and a USB connector, with that a connection cable of the USB connector is electrically interconnected with the wire collection device. In addition, multiple USB flash drives can all operate at a same time. A wallet unit encloses the main unit as a box which is convenient in labeling for drive management and can be carried easily.

The invention discloses an LED bulb which comprises a cap, a cap plastic part, a glass core, an envelope, a plurality of LED filaments and a socket. The cap plastic part is connected with the cap, the glass core is connected with the cap plastic part, the envelope is connected with the glass core tightly, the LED filaments are disposed in the envelope, the socket is connected with the upper end of the glass core, and the LED filaments are inserted to the socket. The socket comprises a socket base plate with a plurality of connection holes and also comprises a plurality of sub sockets matched with the connection holes, and the LED filaments are inserted to the sub sockets. The included angles between the LED filaments and the plane of the socket base plate are smaller than 90 degrees. Since the LED filaments are fixed in an inserted manner, various defects in welding process in the prior art are overcome, and quick and reliable assembling can be achieved. Since the included angles between the LED filaments and the plane of the socket base plate are smaller than 90 degrees, the light distribution effect of lamps is improved.

The inventive plastic card (1) is provided with electric contacts (4) and an electric circuit (3) incorporated therein and is embodied in such a way that it is foldable (6) and insertable from the fold side into the plug socket of an external reading device. The reliable application of the card contacts to the plug socket contacts, in particular of an UBS socket, is secured by the fold flexibility and the selection of a number of parallel folds.

Computing systems with conventional CPUs coupled to co-processors or accelerators implemented in FPGAs (Field Programmable Gate Arrays). One embodiment of the systems and methods according to the invention includes a FPGA accelerator implemented in a computer system by providing an adapter board configured to be used in a standard CPU socket.