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Method and device for hot plugging of sub-board

A technology of hot-plugging and sub-board, applied in the field of communication, can solve the problem that the non-PCIE sub-board cannot be hot-swapped, etc.

Active Publication Date: 2021-11-23
HANGZHOU HIKVISION DIGITAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, it has been found in practice that the current multi-sub-board connection framework only supports hot-swapping of PCIE sub-boards, but cannot realize hot-swapping of non-PCIE sub-boards

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  • Method and device for hot plugging of sub-board
  • Method and device for hot plugging of sub-board
  • Method and device for hot plugging of sub-board

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Embodiment Construction

[0054] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

[0055] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

[0056] In order to enable those skilled ...

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Abstract

The present application provides a method and device for hot swapping a sub-board, the method comprising: when detecting that a target sub-board is inserted into a target slot, determining the type of the target sub-board; When the peripheral components are connected to the PCIE sub-board at a high speed, the hot-swap mode of the target slot is set to non-PCIE mode by the FPGA chip; when the hot-swap button signal corresponding to the target slot is detected, and determined When the target sub-board is in a power-off state, power the target sub-board through the FPGA chip. The method can realize hot plugging of non-PCIE sub-boards.

Description

technical field [0001] The present application relates to communication technology, in particular to a method and device for hot swapping a daughter board. Background technique [0002] The PCIE (Peripheral Component Interconnect Express, high-speed interconnection of peripheral components) bus protocol itself supports hot plugging of sub-boards. Generally, when more sub-boards need to be connected, you can use IO-Expander (IO(Input / output , input / output) expander) way to achieve. [0003] Such as figure 1 As shown, in the multi-sub-board connection framework, a CPU (Center Process Unit, central processing unit) can be connected to multiple IO-Expanders through the PCIE bridge, so as to realize the connection of multiple sub-boards. Among them, IO-Expander is an expansion chip of I2C-GPIO (General Purpose Input Output, general purpose input / output). , two-wire serial bus) bus connection; for the PICE daughter board, the PCIE bridge is also connected to the PCIE daughter b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/40G06F13/38
CPCG06F13/385G06F13/4081G06F2213/0026
Inventor 瞿勇
Owner HANGZHOU HIKVISION DIGITAL TECH
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