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Novel TO-220NB-5L multi-load type lead wire frame

A TO-220NB-5L, load-type lead technology, which is applied in the field of semiconductor packaging, can solve the problems of not meeting the market demand and limiting the scope of use, etc., and achieve the effect of increasing the chip capacity and improving the waterproof effect

Pending Publication Date: 2020-05-12
TAIZHOU YOURUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

TO-220NB-5L lead frame is a common lead frame, however, this lead frame can only mount one chip under the existing technical conditions, which greatly limits its application range and is far from meeting market demand

Method used

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  • Novel TO-220NB-5L multi-load type lead wire frame
  • Novel TO-220NB-5L multi-load type lead wire frame
  • Novel TO-220NB-5L multi-load type lead wire frame

Examples

Experimental program
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Effect test

Embodiment

[0019] Embodiment: A new TO-220NB-5L multi-load lead frame, including a heat sink area 1, a chip loading area 2 and a pin area 3, the heat sink area 1 is located above the loading area 2, and the pin area 3 is located below the loading area 2, The pin area 3 is connected to the carrier area 2 through the connecting piece 4, and the connection between the heat sink area 1 and the chip area 2 is provided with a buffer bar groove 11 of a specific shape, and the cross section of the buffer bar groove is in the middle of an arc on both sides trapezoidal gap; the middle part of the buffer bar groove is provided with an oval auxiliary buffer hole 12; the slide area is divided into two symmetrically distributed sub-module load areas 21, each sub-module load area is a double-layer slide area, by From top to bottom are the first loading area and the second loading area; the first loading area and the second loading area are connected by clamping; the top sides of the first loading area a...

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Abstract

The invention discloses a novel TO-220NB-5L multi-load type lead wire frame, which comprises a heat dissipation sheet area, a chip carrying area and a pin area, wherein the heat dissipation sheet areais positioned above the chip carrying area, the pin area is located below the chip carrying area, the pin area is connected with the chip carrying area through a connecting sheet, the chip carrying area is divided into two symmetrically distributed sub-module chip carrying areas, a chip is installed in each sub-module chip carrying area, a first-stage waterproof structure is arranged on the periphery of the chip carrying area, and a second-stage waterproof structure is arranged on the periphery of the first-stage waterproof structure. According to the invention, through the arrangement of a plurality of mutually independent chip mounting areas and the arrangement of the chip mounting areas into a double-layer structure, the chip carrying capacity of the product is greatly improved, and the defect that the existing lead wire frame can only carry a single chip is overcome; and through the arrangement of the two-stage waterproof structure, the waterproof effect of the product is greatlyimproved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a novel TO-220NB-5L multi-load lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. The TO-220NB-5L type lead frame is a common lead frame, but this lead frame can only mount one chip under the existing technical conditions, which greatly limits its application range and is far from meeting the market demand. Contents of the invention [0003] Purpose of the invention: The purpose of the invention is to pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/00
CPCH01L23/49534H01L23/564
Inventor 张轩
Owner TAIZHOU YOURUN ELECTRONICS
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