A kind of carbon nanotube modified low-temperature solder and its preparation method

A carbon nanotube modification and low-temperature solder technology, which is applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc., can solve the problems of high specific surface energy, poor interface bonding, and difficult dispersion of carbon nanotubes, and achieve Effect of improving drop toughness, improving drop toughness, and enhancing dispersibility

Active Publication Date: 2021-10-29
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the high specific surface energy of carbon nanotubes, it is not easy to disperse in the metal solder matrix, and the interface bonding with the solder matrix is ​​poor. The new generation of solder is an important problem to be solved in the electronics industry

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  • A kind of carbon nanotube modified low-temperature solder and its preparation method
  • A kind of carbon nanotube modified low-temperature solder and its preparation method

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preparation example Construction

[0048] Among the present invention, the preparation method of described modified carbon nanotubes comprises the following steps:

[0049] (1) Acidified carbon nanotubes: Add carbon nanotubes to the mixed acid solution, ultrasonically treat for 2-4h, stir at 50-70°C for 1-3h, and cool to room temperature naturally; after centrifugation, wash with water several times to the lotion The pH value is 7, filtered and dried to obtain acidified carbon nanotubes;

[0050] (2) Activation of carbon nanotubes: Add the acidified nanotubes into the sensitization solution, stir for 20-40min, centrifuge and wash with water several times until the pH value of the washing solution is 7 to obtain sensitized carbon nanotubes; then sensitized carbon nanotubes Add activation solution to the tube, stir for 20-40min, centrifuge and wash with water for several times until the pH of the washing solution is 7, filter and dry to obtain activated carbon nanotubes;

[0051] (3) Electroplating carbon nanotu...

Embodiment 1

[0081] Embodiment 1 provides a carbon nanotube-modified low-temperature solder, which includes the following components by weight percentage: 3% nickel-plated carbon nanotubes, 4.5% hydroxyl multi-walled carbon nanotubes, 3% modified carbon nanotubes, The balance is tin-bismuth series alloy; the weight ratio of nickel-plated carbon nanotubes and hydroxyl multi-walled carbon nanotubes is 1:1.5; the weight ratio of nickel-plated carbon nanotubes and modified carbon nanotubes is 1:1 .

[0082] The nickel-coated carbon nanotubes have a length of 20±10 μm, a diameter of 25±5 nm, and a nickel content of 60%. They were purchased from Beijing Deke Daojin Technology Co., Ltd., model CNT805.

[0083] The tin-bismuth series alloy is Sn42Bi58, purchased from Nangong Zhuyu Alloy Materials Co., Ltd.

[0084] The hydroxyl multi-walled carbon nanotubes have a length of 20±10 μm, a tube diameter of less than 8 nm, and a hydroxyl content of 5.58%. They were purchased from Beijing Deke Daojin T...

Embodiment 2

[0093] Embodiment 2 provides a carbon nanotube-modified low-temperature solder, which includes the following components by weight percentage: 0.05% nickel-plated carbon nanotubes, 0.005% of hydroxyl multi-walled carbon nanotubes, 0.025% of modified carbon nanotubes, The balance is tin-bismuth series alloy; the weight ratio of nickel-plated carbon nanotubes and hydroxyl multi-walled carbon nanotubes is 1:0.1; the weight ratio of nickel-plated carbon nanotubes and modified carbon nanotubes is 1:0.5 .

[0094] The nickel-coated carbon nanotubes have a length of 20±10 μm, a diameter of 25±5 nm, and a nickel content of 60%. They were purchased from Beijing Deke Daojin Technology Co., Ltd., model CNT805.

[0095] The tin-bismuth series alloy is Sn42Bi58, purchased from Nangong Zhuyu Alloy Materials Co., Ltd.

[0096] The hydroxyl multi-walled carbon nanotubes have a length of 20±10 μm, a tube diameter of less than 8 nm, and a hydroxyl content of 5.58%. They were purchased from Beij...

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Abstract

The invention relates to the technical field of low-temperature solder, in particular to a carbon nanotube modified low-temperature solder and a preparation method thereof. A carbon nanotube modified low-temperature solder, in terms of weight percentage, the raw material at least includes the following components: 0.05-5% nickel-plated carbon nanotubes, and the balance is a tin-bismuth series alloy; the length of the nickel-plated carbon nanotubes is 10‑50μm, tube diameter 20‑50nm. The invention provides a low-temperature solder modified by carbon nanotubes, which improves the compatibility between carbon nanotubes and alloys through the compounding and synergy of hydroxyl multi-walled carbon nanotubes and nickel-plated carbon nanotubes, and produces very excellent solder. The effect can effectively improve the toughness and weldability of the solder material, and play a reinforcing role. In addition, the addition of modified carbon nanotubes can not only solve the floating problem of hydroxyl multi-walled carbon nanotubes, improve the drop toughness of solder, but also enhance the dispersion of carbon nanotubes in the solder matrix, and further improve the solder joint strength. drop toughness.

Description

technical field [0001] The invention relates to the technical field of low-temperature solder, in particular to a carbon nanotube modified low-temperature solder and a preparation method thereof. Background technique [0002] The progress of modern electronic manufacturing technology promotes the continuous development of electronic information systems in the direction of miniaturization, high density and multi-function, and the integration level, number of components and I / O pins of the system continue to increase. In order to integrate a variety of chips or devices with different functions into one system, it is necessary to reduce the thermal impact of the packaging process temperature on various chips and devices, especially for thermal mismatch, heat-sensitive materials, flexible substrates, multi-layer IC chips and built-in devices, etc., must be packaged and interconnected at the lowest possible temperature, that is, low-temperature packaging. [0003] To reduce the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/26B23K35/36B23K35/3601B23K35/40
Inventor 陈钦徐华侨张阳张义宾梁少杰翁若伟工梦奇陈旭
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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