PCB blind hole alignment optimization method based on CCD vision

Abstract

The invention discloses a PCB blind hole alignment optimization method based on CCD vision. The PCB blind hole alignment optimization method comprises the following specific steps: 1, converting intoa single channel; 2, carrying out hough circle transformation; 3, clustering; 4, screening a clustering set; 5, determining a circle by three points; 6, screening integral points; 7, realizing accurate radius; 8, improving the precision; 9, screening the points again; and 10, obtaining a final result, and finally performing circle fitting on all the points in the step 9 to obtain a final circle center and radius, thereby realizing alignment of the blind holes. By means of the mode, the PCB blind hole alignment optimization method based on CCD vision solves the optimal value through multiple times of screening iteration to improve the precision, the problems that impurities are too many in blind hole alignment and the alignment precision is not high can be effectively solved, and the blindhole alignment precision can reach 0.3 mil or above.

Description

technical field [0001] The invention relates to the field of graphics processing, in particular to a method for optimizing the alignment of blind holes in a PCB based on CCD vision, and a method for implementing semiconductor lithography imaging software. Background technique [0002] With the rapid development of the semiconductor industry, in the process of printed circuit board (PCB), in order to increase the space utilization rate between the circuit layers of the board, it is necessary to connect the outermost circuit and the adjacent inner layer with plating holes. Such plated holes are called blind holes. Due to the smaller diameter of blind holes, a more precise alignment method is required. [0003] At present, the alignment method of CCD single hole is used, but if the size of the blind hole is too small, less than 4mil, the alignment will become difficult, and at the same time, the accuracy is difficult to guarantee. Contents of the invention [0004] The tech...

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide an optimization method based on CCD visual PCB blind hole alignment, which can effectively solve the problem of too many impurities in blind hole alignment and alignment problems by using multiple screening iterations to find the optimal value and improve the accuracy. The problem of low precision, the accuracy of blind hole alignment can reach more than 0.3mil

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