Chip welding control method and control system
A chip welding and control method technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of high chip manufacturing cost and achieve the effect of avoiding damage
Active Publication Date: 2021-12-10
SHENZHEN PHOGRAIN INTELLIGENT SENSING TECH CO LTD
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Problems solved by technology
[0002] Due to the high manufacturing cost of the chip, in the process of welding the chip and other devices, the suction nozzle is used to absorb the chip and press it on the solder on the soldering seat. The gap and tightness between the chip and the solder determine the chip welding. The degree of excellence, the existing technology is to directly press the chip on the solder without considering the gap between the chip and the solder. When the gap is too small, it is impossible to avoid damage to the chip due to excessive pressure of the suction head; when the gap is too large, it cannot be avoided. Insufficient pressure leads to poor tightness between chip and solder
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[0046] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.
[0047] figure 1 It is a schematic flow chart of a control method for chip bonding in an embodiment. In an embodiment of the present invention, refer to figure 1 , a control method for chip bonding, applied to a chip bonding device, the chip bonding device includes a suction head 210, a push pump 220, a pressure sensor 230, a welding se...
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The present application relates to a control method and control system for chip bonding, which are applied to a chip bonding device. The chip bonding device includes a suction head, a push pump, a pressure sensor, a welding seat and a controller, and the method includes: placing a welding seat pair on it. The welding object is preheated; the suction head adsorbs the chip to be welded; the pump is pushed to push the suction head with the chip adsorbed close to the welding object; the pressure sensor detects the pressure value of the chip pressed on the welding object; the The controller adjusts the pressure of the push pump to push the suction head in real time according to the pressure value. According to the above method, the pushing pressure of the push pump on the suction head can be adjusted in real time, so as to avoid damage to the chip caused by excessive pressure during the welding process, and insufficient welding tightness caused by excessive pressure during the welding process, which affects the yield of welding products.
Description
technical field [0001] The present application relates to the technical field of semiconductors, and in particular to a control method and a control system for chip welding. Background technique [0002] Due to the high manufacturing cost of the chip, in the process of welding the chip and other devices, the suction nozzle is used to absorb the chip and press it on the solder on the soldering seat. The gap and tightness between the chip and the solder determine the chip welding. The degree of excellence, the existing technology is to directly press the chip on the solder without considering the gap between the chip and the solder. When the gap is too small, it is impossible to avoid damage to the chip due to excessive pressure of the suction head; when the gap is too large, it cannot be avoided. Insufficient pressure results in poor die-to-solder tightness. Contents of the invention [0003] In order to solve the above technical problems, the present application provides ...
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IPC IPC(8): H01L21/603H01L21/683H01L21/67
CPCH01L24/80H01L21/67253H01L21/6838H01L2224/80
Inventor 徐虎胡美韶白文陈方均许明生
Owner SHENZHEN PHOGRAIN INTELLIGENT SENSING TECH CO LTD