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Suspended mounting frame for heating device

A technology for heating devices and mounting frames, which is applied in the direction of circuit heating devices, printed circuit components, etc., can solve problems affecting the heat dissipation effect of heating devices, achieve good heat dissipation effects, convenient assembly, and reduce the overall size

Inactive Publication Date: 2020-06-02
XIAN ZHISHENG RUIXIN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found in long-term practice that the setting of heat-conducting materials cannot greatly affect the heat dissipation effect of heat-generating devices.

Method used

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  • Suspended mounting frame for heating device
  • Suspended mounting frame for heating device
  • Suspended mounting frame for heating device

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Please refer to figure 1 and figure 2 as shown, figure 1 is a schematic diagram of the structure of the suspended mounting bracket, figure 2 for figure 1 Partial enlarged view of part A in middle. In order to solve the problem that the heat dissipation effect of the existing heat-conducting silica gel fixing heating elements is not good, this embodiment discloses a suspended mounting frame for heating devices, including a frame body 2, and also includes a frame along the width direction of the frame body 2 A plurality of aluminum heat conduction sheets 3 arranged in sequence, the aluminum heat conduction sheet 3 includes an L-shaped sheet body 31, a fixed body 32 for fixing the L-shaped sheet body 31 on the PCB board 1, and the fixed body 32 is fixed on the L-shaped sheet body 31 There is a gap between the horizontal section and the vertical section 32-2 of the L-shaped sheet body 31 and the PCB board 1 respectively. In this embodiment, the L-shaped piece 31 is f...

Embodiment 2

[0034] On the basis of Embodiment 1, this embodiment discloses a double-layer circuit board structure, including a PCB board 1 for setting electronic devices, and also includes a transformer 500 arranged on the PCB board, a support frame 300 and a circuit board for installation. The mounting frame of the heating device, the mounting frame and the supporting frame 300 are respectively fixed on the PCB board 1, the height of the mounting frame is less than 1 / 4 of the height of the supporting frame 300, and electronic devices are installed in the four legs of the supporting frame 300. The electronic device is fixed on the PCB board 1, and a heating device is installed on the top surface of the installation frame.

[0035] In order to solve the problem that the heat dissipation effect of the existing heat-conducting silica gel fixing heating elements is not good, this embodiment discloses a suspended mounting frame for heating devices, including a frame body 2, and also includes a ...

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Abstract

The invention provides a suspended mounting frame for a heating device. The frame comprises a frame body and a plurality of aluminum heat-conducting fins sequentially arranged in the width direction of the frame body, each aluminum heat-conducting fin comprises an L-shaped fin body and a fixing body for fixing the L-shaped fin body on a PCB, and the fixing body is fixed on the horizontal section of the L-shaped fin body; and gaps are respectively formed between the horizontal section and the vertical section of the L-shaped fin body and the PCB. The L-shaped fin body is fixed to the PCB through the fixing body, the gaps between the L-shaped fin body and the PCB is coated with the heat conduction silica gel, and the heat dissipation coefficient of the aluminum material is higher than that of the heat conduction silica gel, so that compared with a conventional heat conduction silica gel fixing mode, the heat dissipation effect is better.

Description

technical field [0001] The invention relates to the field of installation of suspended components, in particular to a suspended installation frame for heating devices. Background technique [0002] In most electronic devices, heating devices are generally installed, such as main chips, power amplifier modules, power modules, etc. When the heat generation level of the heat-generating device exceeds the heat-dissipating capacity of the device itself, it is necessary to add a heat-dissipating device to enhance the heat-dissipating capacity of the heat-generating device, so as to maintain the reliability of the device. Generally, when a heat generating device is installed, a heat conducting material is usually coated on its bottom surface to enhance heat dissipation. However, it has been found in long-term practice that the arrangement of the heat-conducting material cannot greatly affect the heat dissipation effect of the heat-generating device. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0209
Inventor 张亮李艳娥
Owner XIAN ZHISHENG RUIXIN SEMICON TECH CO LTD
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