ZYNQ program solidification method based on USB

Abstract

The invention discloses a ZYNQ program solidification method based on a USB. The ZYNQ program solidification method comprises the steps that communication connection is established between a ZYNQ chipand an upper PC; sending the solidification program file to a ZYNQ chip through a USB interface of a PC, and storing the solidification program file in a DDR3 storage chip; and performing data erasing operation on the FLASH chip, and writing the solidification program file in the DDR3 storage chip into the FLASH chip. By means of the technical scheme, the ZYNQ program is updated on line, the convenience of product debugging and updating is improved, the cost and time of product debugging and updating are correspondingly reduced, and the adaptability and maintainability of the product are improved.

Description

technical field [0001] The invention relates to the technical field of program solidification, in particular to a USB-based ZYNQ program solidification method. Background technique [0002] ZYNQ chip is Xilinx's SOC chip, the industry's first scalable processing platform, which integrates 7 series FPGA (Field Programmable Gate Array, Field Programmable Gate Array) (Artix-7 and Kintex-7FPGA) and dual-core ARM Cortex -A9 embedded processor, with the powerful parallel processing capability of FPGA programmable logic, and the data signal processing and computing capabilities of ARM, this feature makes ZYNQ chip series widely used in video, surveillance, automotive autonomous navigation, aviation Aerospace and other fields. [0003] For the curing of the ZYNQ program, usually the BOOT.bin file of the ZYNQ chip is written into the external SPI FLASH chip through JTAG, and then each time the ZYNQ chip is powered on, the program will automatically start from the SPI FLASH, thus com...

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Problems solved by technology

[0005] 1. The program must be solidified from the JTAG interface every time. For a product, the JTAG interface is generally not led to the external interface of the product, which causes the problem that it is difficult to update the program version of the product;

[0006] 2. The JTAG-based program curing method is too dependent on the JTAG port. If there are multiple ZYNQ chips on a product, there must be multiple JTAG ports, which increases the layout area of ​​the product PCB board, which is not conducive to the small size of the product. design requirements

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