Layered iterative layout optimization method considering cutting efficiency and utilization rate

A technology of layered iteration and cutting efficiency, applied in data processing application, prediction, calculation, etc., can solve the problem of less joint optimization of two-dimensional layout and cutting efficiency.

Active Publication Date: 2020-06-19
GUANGDONG UNIV OF TECH
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] To sum up, scholars at home and abroad have done a lot of research on the layout optimization problem. There are relatively many studies on the multi-objective optimization problem of one-dimensional blanking and cutting efficiency, while the literature on the joint optimization of two-dimensional layout and cutting efficiency Relatively small

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Layered iterative layout optimization method considering cutting efficiency and utilization rate
  • Layered iterative layout optimization method considering cutting efficiency and utilization rate
  • Layered iterative layout optimization method considering cutting efficiency and utilization rate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0046] refer to Figure 1 to Figure 4 As shown, a layered iterative nesting optimization method considering cutting efficiency and utilization rate in this embodiment includes the following steps:

[0047] Model building: combine cutting efficiency and utilization rate to establish a multi-objective optimization model that minimizes total cost;

[0048] Layout optimization: layout optimization is completed based on the recursive algorithm for nesting layout based on the layered number of stacked boards;

[0049] Hierarchical iterative search: multi-tree hierarchical iterative search method based on utilization threshold and set the threshold;

[0050] Parameter analysis and optimization: analyze and optimize the parameters obtained by layered iterative search;

[0051] Computational experiments a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a layered iterative layout optimization method considering cutting efficiency and utilization rate. The method comprises the following steps: establishing a model: establishinga multi-objective optimization model for minimizing the total cost in combination with the cutting efficiency and the utilization rate; slice typesetting is conducted, specifically, stacked slices are completed through a layout recursive algorithm based on stacked plate number layering; setting a threshold value: setting the threshold value based on a multi-way tree hierarchical iterative searchmethod of a utilization rate threshold value; analyzing and optimizing parameters: analyzing and optimizing the parameters obtained by hierarchical iterative search; calculation experiment and analysis: testing and analyzing through experiments to verify the feasibility and effectiveness of algorithm results; the invention aims to provide the layered iterative layout optimization method considering the cutting efficiency and the utilization rate, the utilization rate of raw materials is improved, batch cutting can be realized, and the cutting frequency and the cutting knife number can be greatly reduced, so that the raw material cost is reduced, the production efficiency is improved, and the total production cost is reduced.

Description

technical field [0001] The invention relates to the field of plate layout optimization, in particular to a layered iterative layout optimization method considering cutting efficiency and utilization rate. Background technique [0002] With the in-depth research on blanking, there is little room for improvement in material utilization. In order to minimize the total cost of blanking, it is necessary to jointly consider the optimization of cutting costs. At present, there are relatively few literatures on two-dimensional layout and considering cutting efficiency. Haessler was the first to study the problem of minimizing the cutting mode. He believed that the number of cutting modes would increase the cost of the enterprise. Therefore, it is necessary to limit the number of cutting modes and establish a multi-objective nonlinear mixed integer programming one-dimensional cutting model to minimize the cost of waste. and processing costs. Cui proposed a heuristic algorithm for t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/04
CPCG06Q10/043
Inventor 张浩刘强严都喜吴兰彬张定
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap