Semiconductor module, display device, and semiconductor module production method
A manufacturing method and semiconductor technology, which can be applied to semiconductor devices, manufacturing tools, and electric solid-state devices, etc., can solve problems such as the reduction of light extraction efficiency, and achieve the effect of improving light extraction efficiency.
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no. 1 approach
[0026] figure 1 and figure 2 It is a figure explaining the manufacturing method of the semiconductor module 1 which concerns on 1st Embodiment. image 3 It is a flowchart of the manufacturing method of the semiconductor module 1 concerning 1st Embodiment. For the composition and manufacturing method of semiconductor modules, based on figure 1 , figure 2 ,as well as image 3 Be explained. figure 2 to simplify figure 1 In the diagram showing a part of the configuration of the semiconductor module 1 , the metal wiring 12 and the insulating layer 13 are omitted, and the substrate-side electrode 141 and the light-emitting element-side electrode 142 are shown as electrodes 14 . In addition, a display device that includes the semiconductor module 1 and displays an image is also included in the technical scope of the present invention.
[0027] (Structure of semiconductor module 1)
[0028] Such as figure 2 As shown in (e), the semiconductor module 1 includes a base subst...
no. 2 example
[0099] Figure 4 It is a sectional view showing the structure of the semiconductor module 2 according to the second embodiment of the present invention. In addition, for the sake of convenience of description, members having the same functions as those already described in the above-mentioned embodiments are denoted by the same reference numerals, and the description thereof will not be repeated.
[0100] (Structure of semiconductor module 2)
[0101] Semiconductor module 2 such as Figure 4 As shown, compared with the semiconductor module 1, the difference is that the color conversion layers 31, 32 are changed into color conversion layers 31a, 32a. The color conversion layers 31 a and 32 a have different thicknesses in the direction from the base substrate 11 toward the light emitting element 15 than the color conversion layers 31 and 32 . The height of the color conversion layers 31 a and 32 a from the base substrate 11 is preferably lower than the height of the light shi...
no. 3 example
[0104] Figure 5 It is a sectional view showing the structure of the semiconductor module 3 according to the third embodiment of the present invention. In addition, for the sake of convenience of description, members having the same functions as those already described in the above-mentioned embodiments are denoted by the same reference numerals, and the description thereof will not be repeated.
[0105] (Structure of semiconductor module 3)
[0106] Semiconductor modules 3 such as Figure 5 As shown, compared with the semiconductor module 1 , the difference is that a transparent resin layer 33 is disposed on the top of one light emitting element 15 among the three light emitting elements 15 . The transparent resin layer 33 passes the light emitted from the light emitting element 15 and emits from the top surface thereof. The transparent resin layer 33 passes the light without converting the wavelength of the light emitted from the light emitting element 15 disposed directl...
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Abstract
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