Radio frequency copper detector and automatic correction system and detection method and automatic correction method

Abstract

The invention relates to an etching process system and method. The etching process system comprises a radio frequency copper detector and a pre-etching device. The radio frequency copper detector comprises a plurality of sensors, each sensor can emit and receive radio frequency, and radio frequency covering ranges of the multiple sensors overlap one another and are sufficient to stretch across the two ends of a substrate for etching. After scanning the substrate, the radio frequency copper detector transmits data to the pre-etching device for compensating spraying, so as to correct the abnormal thickness and uniformity. Therefore, according to the etching process system and method, all surfaces of each substrate can be scanned one by one and completely, and the obtained thicknesses of thesurface copper plating or the uniformity of the surface copper plating thickness is very accurate, and the detection time required is short, and after the data is obtained, pre-etching can be carriedout immediately for correction, and thus the waste of resources and costs is greatly reduced.

Description

technical field [0001] The invention relates to an etching process system and an etching process method. Background technique [0002] The etching process is one of the commonly used processes in the modern high-tech industry to manufacture electronic components such as chips. Etching generally works by engraving desired shapes on the surface of a substrate using physical or chemical reactions. Generally speaking, the aforementioned substrate is usually a multilayer board with copper foil plated on its surface, while the etching process in the prior art is to spray a chemical solvent corrosive to the copper foil on the surface of the copper foil to achieve the purpose of etching. Therefore, the thickness of the copper foil plated on the surface of the substrate and the uniformity of the thickness of the copper foil become important factors affecting the yield of the etching process. [0003] Therefore, in the prior art, the operator of the etching process must first measur...

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Problems solved by technology

[0005] However, this method is quite time-consuming, so it can only be sampled and cannot detect all the substrates 92, so that the obtained results are relatively inaccurate

and, if Figure 8 As shown, the detection by the contact sensor 91 can only arrange the detection points 921 on the substrate 92 as much as possible, but cannot reliably detect all the surfaces of the substrate 92, resulting in the generation of undetected gaps 922, which will also cause make test results less accurate

The above two shortcomings will lead to a decline in the yield of the entire etching process

[0006] In addition, after the inspection of the substrate 92, if the copper plating thickness and the uniformity of the copper plating thickness do not meet the acceptable error range of the etching process, they will be eliminated in batches, which is quite a waste of resources and costs.

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