Wire and adhesive film bonding quality recognition device
A technology for identifying devices and quality labels, applied in semiconductor/solid-state device testing/measurement, semiconductor devices, sustainable manufacturing/processing, etc., to achieve the effect of improving accuracy
Pending Publication Date: 2020-06-23
DONGJUN NEW ENERGY CO LTD
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Problems solved by technology
In practical applications, it is found that the image recognition method cannot reliably identify the problem that the wire and the film are not well bonded
Method used
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[0039] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.
[0040] figure 1 It is a schematic diagram of part of the structure of the wire and film bonding quality identification device, figure 1 The general structure of the device provided by the embodiment of the present application is shown. See figure 1 , The identification device for the bonding quality of the wire and the adhesive film includes a pressing assembly 11 , a first conductive roller 12 , a second conductive roller 13 , a power supply 14 and an electrification detection component 15 .
[0041] The pressing assembly 11 is used to apply a certain pressin...
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The invention provides a wire and adhesive film bonding quality recognition device. The wire and adhesive film bonding quality recognition device comprises a pressing assembly, a first conductive roller, a second conductive roller, a power supply, an energization detection component and a quality identification assembly, wherein the first conductive roller is arranged on the input end side of thepressing assembly; the second conductive roller is arranged on the output end side of the pressing assembly; two wiring ends of the power supply are respectively connected with the first conductive roller and the second conductive roller; the energization detection component is electrically connected with the first conductive roller and the second conductive roller, and is used for detecting theelectric connection state of the first conductive roller and the second conductive roller and outputting a first detection signal when the first conductive roller and the second conductive roller aredisconnected in energization; the quality identification assembly identifies an adhesive film located in a predetermined section when the energization detection component outputs the first detection signal. According to the identification method, the identification area is determined directly according to the on-off state of the wire, and the identification accuracy is greatly improved compared with that of a photographing recognition method.
Description
technical field [0001] The present application relates to the technical field of solar cell assembly, in particular to a device for identifying the bonding quality of wires and adhesive films. Background technique [0002] In the solar cell, the photovoltaic units are connected in series by wires (or confluence strips, drainage strips) to increase the output voltage and realize the output of electric energy. Most of the wires used to connect photovoltaic cells in thin-film solar cells are thin wires. [0003] Considering the characteristics of photovoltaic units and wires in thin-film solar cells, in the assembly and production of thin-film solar cells, the wires are often bent first to form waves and then adhere to the adhesive film; then the adhesive film is bonded to the photovoltaic unit to make the folding Different regions of the bent wires are connected to the opposite electrode ends of adjacent photovoltaic units to realize the series connection of the photovoltaic ...
Claims
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IPC IPC(8): H01L21/66H01L31/18
CPCH01L22/14H01L31/18Y02P70/50
Inventor 张建坡
Owner DONGJUN NEW ENERGY CO LTD