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Circuit board device and its manufacturing method, electronic equipment

A technology of circuit boards and substrates, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as easy short circuits in packaged chips, and achieve the effect of solving short circuits and stable and reliable connections

Active Publication Date: 2022-05-20
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a circuit board device, a preparation method thereof, and electronic equipment, which can solve the problem that a short circuit is likely to occur in the process of packaging a packaged chip on a circuit board

Method used

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  • Circuit board device and its manufacturing method, electronic equipment
  • Circuit board device and its manufacturing method, electronic equipment
  • Circuit board device and its manufacturing method, electronic equipment

Examples

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Embodiment Construction

[0040] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0042] Please refer to Figure 1 to Figure 13 , the embodiment of the present invention discloses a circuit board device, and the disclosed circuit board device includes a substrate 100 , a chi...

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PUM

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Abstract

The invention discloses a circuit board device. The disclosed circuit board device comprises a substrate (100), the substrate (100) is provided with a first pad (110); the chip module (200) is provided with a second pad (210), and the first pad (110) is electrically connected to the second pad (210), and a filling space (300) is formed between the chip module (200) and the substrate (100); The supporting member (400) is supported between the substrate (100) and the chip module (200); the filling part (500) is filled in the filling space (300). The above-mentioned solution can solve the problem that a short circuit easily occurs during the packaging process of the packaged chip on the circuit board. The invention also discloses a preparation method of the circuit board device and electronic equipment.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board device, a preparation method thereof, and electronic equipment. Background technique [0002] At present, chips generally have WLCSP (Wafer Level Chip Scale Packaging) packaged chips according to the package type, BGA (Ball Grid Array Package, ball grid array package) packaged chips, LGA (Land Grid Array, grid array package) Package) packaged chips and QFN (Quad Flat No-lead-Package, square flat no-lead package) packaged chips, etc., in which the upper layer of the packaging structure of the LGA packaged chip is a plastic packaging material, and the lower layer is a packaged carrier board, but the LGA packaged chip There is only a pad at the bottom, and solder paste needs to be printed on the circuit board for soldering when soldering at the board level. [0003] In the specific board-level soldering process, when the LGA package chip is mounted on the cir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/492H01L23/488H01L23/12H01L23/13H01L23/31
CPCH01L23/492H01L23/488H01L23/12H01L23/13H01L23/3121H01L2224/13H01L2224/1354H01L2224/81192H01L2224/8114H01L2224/16225H01L2924/181H01L2924/00012
Inventor 杨望来
Owner VIVO MOBILE COMM CO LTD
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