Circuit board device and its manufacturing method, electronic equipment

Abstract

The invention discloses a circuit board device. The disclosed circuit board device comprises a substrate (100), the substrate (100) is provided with a first pad (110); the chip module (200) is provided with a second pad (210), and the first pad (110) is electrically connected to the second pad (210), and a filling space (300) is formed between the chip module (200) and the substrate (100); The supporting member (400) is supported between the substrate (100) and the chip module (200); the filling part (500) is filled in the filling space (300). The above-mentioned solution can solve the problem that a short circuit easily occurs during the packaging process of the packaged chip on the circuit board. The invention also discloses a preparation method of the circuit board device and electronic equipment.

Description

technical field

[0001] The invention relates to the technical field of circuit boards, in particular to a circuit board device, a preparation method thereof, and electronic equipment. Background technique

[0002] At present, chips generally have WLCSP (Wafer Level Chip Scale Packaging) packaged chips according to the package type, BGA (Ball Grid Array Package, ball grid array package) packaged chips, LGA (Land Grid Array, grid array package) Package) packaged chips and QFN (Quad Flat No-lead-Package, square flat no-lead package) packaged chips, etc., in which the upper layer of the packaging structure of the LGA packaged chip is a plastic packaging material, and the lower layer is a packaged carrier board, but the LGA packaged chip There is only a pad at the bottom, and solder paste needs to be printed on the circuit board for soldering when soldering at the board level.

[0003] In the specific board-level soldering process, when the LGA package chip is mounted on the cir...

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