Computer dustproof heat dissipation case

A computer and dust-proof technology, which is applied in the computer field, can solve the problem that the dust-proof and heat dissipation of the chassis cannot be balanced, and achieve the effect of dust-proof and heat-dissipation firmness, cleanliness and light weight

Active Publication Date: 2020-07-03
深圳市金卡科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above situation, in order to solve the problems existing in the prior art, the object of the present invention is to provide a computer dust-proof and heat-dissipating chassis, which can effectively solve the problem that the dust-proof and heat dissipation of the chassis cannot be balanced.

Method used

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  • Computer dustproof heat dissipation case
  • Computer dustproof heat dissipation case
  • Computer dustproof heat dissipation case

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Embodiment Construction

[0015] The specific implementation manners of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] Depend on Figure 1 to Figure 7 Given, the present invention comprises a box plate 1, and two through holes 2 are provided on the box plate 1, and a fan 3 is installed in the through holes 2; Net 4, the outside of the first filter screen 4 is equipped with the second filter screen 5 that can move left and right, and the outside of the second filter screen 5 is equipped with the third filter screen 6 that can move left and right; the first filter screen 4, the second filter screen The number of meshes of the net 5 and the third filter screen 6 increases successively; the three filter screens are composed of four faces, the front, the rear, the top, and the bottom; The left side is fixed with a second baffle 8 that can be tenoned with the first baffle 7; the left side of the third filter screen 6 is fixed with a th...

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Abstract

The invention relates to a computer dustproof heat dissipation case which effectively solves the problem that dust prevention and heat dissipation of a case cannot be achieved at the same time. According to the technical scheme, the computer dustproof heat dissipation case comprises a box plate, two through holes are formed in the box plate, and fans are installed in the through holes; three layers of filter screens are fixed on the left side of the box plate; a baffle is arranged on each layer of filter screen; brushes are arranged on the inner side surfaces of the third filter screen and thesecond filter screen; two power devices corresponding to the second filter screen and the third filter screen respectively are fixed on the box plate, and each power device is composed of a main piston cavity fixed on the box plate and a plurality of auxiliary piston cavities corresponding to the main piston cavity; the main piston cavity is communicated with the plurality of auxiliary piston cavities through pipelines; an auxiliary piston rod is arranged in the auxiliary piston cavity, penetrates through the box plate and is fixed with the second filter screen or the third filter screen; after the main piston cavity is compressed, the second filter screen or the third filter screen is pushed to move leftwards through the auxiliary piston rod in the auxiliary piston cavity, the size is small, the weight is light, and the dustproof effect can be automatically adjusted according to temperature changes.

Description

technical field [0001] The invention relates to the field of computers, in particular to a computer dust-proof and heat-dissipating chassis. Background technique [0002] A computer case is generally provided with a plurality of case fans, so that the inside of the case forms a front-to-back airflow for heat dissipation. However, because there is a lot of dust in the air, there are also some poplar catkins, paper scraps, and other sundries that are easy to adhere to the case; therefore, after the case is used for a certain period of time, more dust will accumulate inside the case. Especially the internal graphics card and CPU radiator will accumulate a lot of sundries and dust, which will seriously affect the heat dissipation effect. It is precisely because of the excessive dust that many users currently choose to paste a relatively dense dust-proof film on the fan of the chassis, which can effectively block the entry of dust, but while reducing the entry of dust, it also r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20B01D46/00B01D46/12B01D46/42
CPCG06F1/183G06F1/20B01D46/12B01D46/0054B01D46/4227B01D46/681
Inventor 马耀锋李红丽潘会强魏富豪杨洪彩
Owner 深圳市金卡科技有限公司
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