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Treatment method of grinding disc

A processing method and technology of grinding discs, which are applied in the direction of grinding devices, grinding/polishing equipment, metal processing equipment, etc., can solve the problems of shedding, productivity reduction, and rapid decline in cutting rate, etc.

Pending Publication Date: 2020-07-07
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to obtain a better grinding roughness, finer and smaller diamond powder is required to prepare the grinding liquid. However, the embedding force of the smaller diamond particles on the grinding disc becomes smaller, and it is easy to fall off from the base material of the grinding disc. The rate drops rapidly, which reduces the life of the grinding disc, thereby reducing productivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The processing method of the grinding disc of the present invention will be further described below in conjunction with the examples, but the present invention is not limited thereby.

[0018] One embodiment of the processing method of grinding disc of the present invention comprises the following steps:

[0019] providing a grinding disc substrate;

[0020] pressing the grinding disc substrate;

[0021] scraping the grinding disc substrate;

[0022] Carrying out preheat treatment to described grinding disc base material;

[0023] A diamond grinding liquid is embedded on a predetermined surface of the grinding disc substrate to form a surface layer.

[0024] Specifically, the substrate is made of metal or stainless steel, preferably a tin plate. After the pressing and scraping treatment, the surface of the grinding disc substrate is flattened, and the surface and edge positions are scraped clean for subsequent processing. It should be noted that the pressing and sc...

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PUM

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Abstract

The invention provides a treatment method of a grinding disc. The treatment method comprises the following steps of: providing a grinding disc substrate; pressing the grinding disc substrate; scrapingthe grinding disc substrate; pre-heating the grinding disc substrate; and embedding a diamond grinding fluid on the predetermined surface of the grinding disc substrate to form a surface layer. The method provided by the invention can improve the embedding force between the diamond grinding fluid and the grinding disc substrate, and increase the hardness of the grinding disc, so the service lifeof the grinding disc is prolonged and the grinding effect is improved.

Description

technical field [0001] The invention relates to the semiconductor field, in particular to a processing method for a grinding disc used for semiconductor grinding. Background technique [0002] With the rapid development of science and technology, higher and higher requirements are put forward for microelectronic semiconductor technology, and the grinding technology of semiconductor needs to be more and more refined. [0003] During the grinding process, the surface of the semiconductor wafer is in contact with the surface of the grinding disc, and then the original uneven wafer surface is flattened by the friction between the wafer surface and the grinding disc. To maintain the roughness to keep the grinding rate stable, the currently used grinding discs are prepared by adhering fine diamond particles on stainless steel plates. In order to obtain a better grinding roughness, finer and smaller diamond powder is required to prepare the grinding liquid. However, the embedding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
CPCB24D18/0009B24D18/0054
Inventor 金志民
Owner SAE TECH DELEVOPMENT DONGGUAN