Feeding clamp and injection molding stamping equipment with same

Abstract

The invention discloses a feeding clamp and injection molding stamping equipment with the same. The feeding clamp comprises a first fixing seat, a first knocking assembly, a first transmission rod anda first driving mechanism; the first fixing seat is provided with a first feeding hole; the first knocking assembly is connected with the first fixing seat and used for impacting a first material inserted into the first feeding hole into processing equipment; the first transmission rod is connected with the first knocking assembly; and the first driving mechanism is connected with the first knocking assembly through the first transmission rod and used for driving the first knocking assembly to impact the first material so as to impact the first material into the processing equipment. The feeding clamp has the advantages of simple and compact structure, convenient feeding, high compatibility, good synchronization performance, low maintenance cost and high production efficiency.

Description

technical field [0001] The invention relates to the technical field of injection molding, in particular to a material loading fixture and injection molding stamping equipment with the material loading fixture. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. [0003] With the development of technology, the miniaturization and multi-function of electronic products have become the main development direction. The miniaturization of electronic products requires semiconductor devices not only to be smaller in size, but also to ensure their structural strength and anti-pollution and anti-corrosion performance. Therefore, injection molding packaging is required. However, in the prior art, ...

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Problems solved by technology

[0003] With the development of technology, the miniaturization and multi-function of electronic products have become the main development direction. The miniaturization of electronic products requires semiconductor devices not only to be smaller in size, but also to ensure their structural strength and anti-pollution and anti-corrosion performance. Therefore, injection molding packaging is required. However, in the prior art, manual feeding is still required for injection molding, and the production efficiency is low, which greatly restricts the development of smart devices. Therefore, it is necessary to provide a simple and compact structure and convenient feeding. The feeding fixture has become a problem that must be solved at present

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