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Method for improving solder resist oil leakage of PCB

A kind of PCB board and solder mask technology, applied in the field of PCB board production, can solve the problems of slow production of special plug hole oil, anti-welding oil, affecting appearance, etc.

Pending Publication Date: 2020-07-07
惠东县建祥电子科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing production process of circuit boards, for PCB boards that must be protected against soldering and plugged through holes, for some special structures, such as the case where the copper surface of the solder mask layer has a single-sided window, according to the normal Production process, the abnormal phenomenon of anti-soldering oil is easy to appear after the development of the position, which affects the appearance
[0003] Nowadays, the PCB industry has more and more strict requirements on the appearance of circuit boards. For the particularity of one-sided window opening, which is prone to oil leakage, it is necessary to take control methods to reduce defective scrap and customer complaints. There are generally two methods to control oil leakage: one is to purchase special plug oil to adjust and reduce ink fluidity to avoid oil leakage; the other is to increase pre-baking parameters and adjust post-baking segment time To reduce oil leakage, use the above two methods to control the raw materials for process control. Although the oil leakage after counter-position development has been improved, it is still not ideal, and oil leakage is still prone to occur, even repeatedly, and special plug holes are purchased. Oil production is slow, wasting manpower and material resources

Method used

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  • Method for improving solder resist oil leakage of PCB

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Embodiment Construction

[0024] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0025] Such as figure 1 As shown, the embodiment of the present invention provides a method for improving solder resistance and oil leakage of PCB board, including the following steps:

[0026] Ink preparation, add 5-8ml plug thinner to 1kg plug oil and stir evenly; add 20-45ml top oil thinner to 1kg top oil and stir evenly.

[0027] Process the PCB board 1, pass the PCB board 1 through the brushing machine before printing the solder mask, control the current of the upper line brush board to 2.2A, the speed is 2.5m / min, and the offline brush board current is 3.4A, and the speed is 2.5m / min.

[0028] For plugging and printing oil, the plugging oil is used to carry out the plugging oper...

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Abstract

The invention relates to a method for improving solder resist oil leakage of a PCB, which comprises the steps of ink preparation, PCB processing, hole plugging and oil printing, pre-baking, film manufacturing, alignment exposure and thermocuring. The method solves the problem of solder resist oil leakage of the PCB by controlling various parameters.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a method for improving PCB board solder resistance and oil leakage. Background technique [0002] In the existing production process of circuit boards, for PCB boards that must be protected against soldering and plugged through holes, for some special structures, such as the case where the copper surface of the solder mask layer has a single-sided window, according to the normal Process flow production, after the development of the position, it is easy to appear the abnormal phenomenon of anti-soldering and oil leakage, which will affect the appearance. [0003] Nowadays, the PCB industry has more and more strict requirements on the appearance of circuit boards. For the particularity of one-sided window opening, which is prone to oil leakage, it is necessary to take control methods to reduce defective scrap and customer complaints. There are generally two methods to control o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/00
CPCH05K3/282H05K3/0094H05K2203/025
Inventor 张剑锋吴玫芥商泽丰黎光海
Owner 惠东县建祥电子科技有限公司
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