Laser processing method of printed circuit board and laser processing machine thereof
A laser processing method and technology for printed circuit boards, which are used in printed circuits, printed circuit manufacturing, laser welding equipment, etc. to improve quality, reduce peeling and cracks in insulating layers, and improve packaging density.
Active Publication Date: 2022-06-28
OFUNA TECH
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Problems solved by technology
Also, if the number of shots is increased without changing the pulse width Pw, since the time required for the positioning of the galvanometer mirrors 5a and 5b is about 0.4ms (frequency 2.5kHz) as described above, each time the number of shots is increased, the processing of one hole The time is increased by 0.4ms
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[0064] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.
[0065] refer to Figure 1 to Figure 5 , figure 1 It is an overall view of a first embodiment of the laser processing machine for printed circuit boards of the present invention, and the same symbols as those in the prior art or objects with the same functions are attached and detailed descriptions are omitted.
[0066] The first embodiment includes a laser output device 110, a first plate 20 (hereinafter referred to as a large plate 20 ) with a plurality of apertures 41, 42-4n, a galvanometer 5, and an fθ lens 6. The apertures 41, 42-4n shape the outer diameter of a laser beam 2 output from the laser output device 110, and the shaped laser beam 2 is shaped by the galvanometric device 5 and the fθ lens 6. position.
[0067] Between the laser output device 110 and a galvanometer mirror 5a, the disc-shaped large...
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Abstract
A laser processing method for a printed circuit board and a laser processing machine thereof, the laser processing machine includes a laser output device, a first flat plate including a plurality of apertures, a current detection device, an fθ lens, a first flat plate positioning device, and m-th Two flat plates, and m second flat plate positioning devices, each second flat plate includes n apertures. When processing at least one layer of copper layer, the axis of the designated aperture of the first plate is coaxially positioned with the axis of the laser, and the m second plates are positioned at the withdrawal position. When processing at least one layer of insulating layer , positioning the specified second plate at the processing position so that the axis of one of the specified n×m apertures is positioned coaxially with the axis of the laser, and the specified diameter ratio of the aperture is processed by the The diameter of the aperture used is small for at least one copper layer. Thereby, holes of good quality can be processed efficiently.
Description
technical field [0001] The invention relates to a processing method of a circuit board and a processing machine thereof, in particular to a laser processing method of a printed circuit board and a laser processing machine thereof. Wherein, a blind hole (unperforated, hereinafter, simply referred to as a hole) or a through hole is formed at a desired position of the combined printed circuit board, and the blind hole is to connect the surface copper layer and the lower layer copper layer; the through hole is The surface and the back of the double-sided substrate are respectively processed to connect the surface copper layer and the back copper layer. Background technique [0002] The built-up printed circuit board is composed of a copper layer that is a conductor, and an insulating layer (hereinafter, simply referred to as an "insulating layer") formed of resin containing glass fibers or fillers. As the copper layer, there are not only copper layers with a thickness of 5 to 1...
Claims
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IPC IPC(8): B23K26/082B23K26/0622B23K26/14B23K26/064B23K26/70H05K3/00
CPCB23K26/082B23K26/0622B23K26/14B23K26/0648B23K26/702H05K3/0026B23K26/382B23K26/04B23K26/062
Inventor 荒井邦男金谷保彦
Owner OFUNA TECH