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A kind of preparation method of underfill glue with high electrical insulation performance

A technology of underfill glue and insulation performance, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., and can solve the problems of electrical insulation performance attenuation, heat resistance and moisture absorption, and short-circuit failure of components, etc.

Active Publication Date: 2022-03-22
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The heat resistance and moisture absorption of general-purpose underfill packaging materials cannot meet the technical requirements of current electronic packaging materials, and both have the problem of serious attenuation of electrical insulation properties after damp heat aging.
It is far from meeting the needs of today's packaging technology with increasingly smaller wiring spacing (below 25 μm), and components are prone to short-circuit failure after high voltage is applied

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] a. In terms of parts by mass: Add 830g of bisphenol F epoxy resin NPEF-170F into the reactor, heat and start stirring, set the speed at 10RPM, when the temperature in the reactor is heated to 190°C, diaminodiphenyl Add 170g of sulfone DDS into the reaction kettle, keep the temperature in the reaction kettle, set the speed at 25RPM under vacuum, and stir for 3 hours; lower the temperature in the reaction kettle to 160°C, add the accelerator boron trifluoride-monoethylamine complexation Object BF 3 -MEA 5g, continued stirring for 2 hours in a nitrogen-protected environment, prepared from the synthesis of diaminodiphenylsulfone modified epoxy resin;

[0027] b. In parts by mass: self-synthesized diaminodiphenyl sulfone modified epoxy resin 350g, low viscosity epoxy resin EXA-830LVP 150g, biphenyl type epoxy resin NC-3000 300g, black pigment 10g, curing agent PN -40J 200g, put into the stirring tank successively, set the rotation speed at 35 RPM under the vacuum condition,...

Embodiment 2

[0029] a. In terms of parts by mass: Add 830g of bisphenol F epoxy resin NPEF-170F into the reactor, heat and start stirring, set the speed at 10RPM, when the temperature in the reactor is heated to 180°C, diaminodiphenyl Add 170g of sulfone DDS into the reaction kettle, keep the temperature in the reaction kettle, set the speed at 25RPM under vacuum, and stir for 3 hours; lower the temperature in the reaction kettle to 150°C, add the accelerator boron trifluoride-monoethylamine complexation Object BF 3 -MEA 5g, continued stirring for 2 hours in a nitrogen-protected environment, prepared from the synthesis of diaminodiphenylsulfone modified epoxy resin;

[0030] b. In parts by mass: self-synthesized diaminodiphenyl sulfone modified epoxy resin 350g, low viscosity epoxy resin EXA-835LV 150g, biphenyl type epoxy resin NC-3000 300g, black pigment 10g, curing agent PN -H 200g, put into the stirred tank in turn, set the rotation speed at 35 RPM under the vacuum condition, and stir...

Embodiment 3

[0032] a. In terms of parts by mass: Add 830g of bisphenol F epoxy resin NPEF-170F into the reactor, heat and start stirring, set the speed at 10RPM, when the temperature in the reactor is heated to 190°C, diaminodiphenyl Add 170g of sulfone DDS into the reaction kettle, keep the temperature in the reaction kettle, set the speed at 25RPM under vacuum, and stir for 3 hours; lower the temperature in the reaction kettle to 160°C, add the accelerator boron trifluoride-monoethylamine complexation Object BF 3 -MEA 5g, continued stirring for 2 hours in a nitrogen-protected environment, prepared from the synthesis of diaminodiphenylsulfone modified epoxy resin;

[0033] b. In parts by mass: self-synthesized diaminodiphenyl sulfone modified epoxy resin 350g, low viscosity epoxy resin EXA-830LVP 200g, biphenyl type epoxy resin NC-3000FH 300g, black pigment 10g, curing agent PN -31J 200g, put into the stirred tank in turn, set the rotation speed at 35 RPM under the vacuum condition, and...

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PUM

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Abstract

The invention relates to a bottom filling glue with high electrical insulation performance, which is composed of the following raw materials: 25-35 parts of self-synthesized diaminodiphenyl sulfone modified epoxy resin, 15-20 parts of low-viscosity epoxy resin, biphenyl ring 25-35 parts of oxygen resin, 0.1-0.4 parts of black pigment, 15-20 parts of curing agent. The underfill adhesive prepared by the invention has the advantages of high volume resistivity, high glass transition temperature, low water absorption, and good electrical insulation performance especially after aging in a humid and hot environment, and is suitable for semiconductor electronic components mounted on various bare chips. encapsulation.

Description

technical field [0001] The invention relates to a method for preparing a bottom filling glue with high electrical insulation performance, belonging to the field of adhesives. Background technique [0002] With the miniaturization, light weight and high performance of electronic equipment, semiconductor packaging materials are required to adapt to the development of high integration and thinning of electronic devices. In recent years, surface-mount packaging has become the first choice. During installation, semiconductor packaging materials must withstand high-temperature solder baths. During this process, electronic devices are cracked due to the gasification and expansion of moisture-absorbing water molecules. In order to solve this problem, the underfill packaging material is required to have good heat resistance and low water absorption. [0003] The heat resistance and moisture absorption of general-purpose underfill packaging materials cannot meet the technical require...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/00
CPCC09J163/00C08L2205/03C08L2205/025C08L2201/08C08L2203/206C08L63/00
Inventor 闫善涛陈田安王建斌
Owner YANTAI DARBOND TECH
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