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37results about How to "Increased curing crosslink density" patented technology

Epoxy adhesive toughened by tertiary-amide modified liquid nitrile butadiene rubber

The invention discloses an epoxy adhesive toughened by tertiary-amide modified liquid nitrile butadiene rubber. The adhesive is prepared from the following components in parts by weight: 100 parts of bisphenol-A or bisphenol-F epoxy resin, 8 to 60 parts of amine curing agent and 10 to 70 parts of tertiary-amide modified liquid nitrile butadiene rubber. The curing condition is that all components are uniformly mixed and are cured at a room temperature for 4 to 7 days or are cured at a temperature of 50 DEG C for 1 day. The adhesive has main properties that the tensile strength is 20 to 40 MPa, the elongation at break is 5 percent to 30 percent, the impact strength is 20 to 150 kJ / m2 and high-temperature glass transition temperature is 90 to 120 DEG C. The toughened epoxy adhesive disclosed by the invention has the advantages that excellent mechanical property and excellent toughness are obtained; the curing cross-linking density of the epoxy resin is improved, the high-temperature glass transition temperature of the epoxy adhesive is not reduced, and the high-temperature usage temperature of the adhesive is not reduced while the adhesive is toughened by utilization of the characteristics of catalyzing and curing epoxy functional groups by a tertiary amine group.
Owner:NANJING UNIV

Modification method for coating silicon-carbon composite negative electrode material interface with modified asphalt

The invention relates to the technical field of lithium battery materials, and in particular relates to a modification method for coating a silicon-carbon composite negative electrode material interface with modified asphalt. The asphalt-coated silicon-carbon composite negative electrode material is subjected to interface modification by utilizing specially selected phenolic resin, so that the silicon-carbon composite negative electrode material with high rate performance and high first rate is prepared. And a compact nano carbon coating layer with low pore defect degree is formed, so that the defects such as cracks and holes on the surfaces of nano silicon and graphite can be effectively repaired, irreversible consumption of a large number of active lithium ions in the charging and discharging process of a battery is avoided, and irreversible reduction of the battery capacity is remarkably reduced. Therefore, the asphalt-coated silicon-carbon composite negative electrode material is subjected to interface modification by utilizing the mutual synergistic effect of the phenolic resin and the asphalt, the capacity diving condition during high-current charging and discharging of the battery is obviously delayed, and the rate capability and coulombic efficiency of the material are improved.
Owner:西安英纳吉科技有限公司

Tertiary Amine Modified Liquid Nitrile Rubber Toughened Epoxy Adhesive

The invention discloses an epoxy adhesive toughened by tertiary-amide modified liquid nitrile butadiene rubber. The adhesive is prepared from the following components in parts by weight: 100 parts of bisphenol-A or bisphenol-F epoxy resin, 8 to 60 parts of amine curing agent and 10 to 70 parts of tertiary-amide modified liquid nitrile butadiene rubber. The curing condition is that all components are uniformly mixed and are cured at a room temperature for 4 to 7 days or are cured at a temperature of 50 DEG C for 1 day. The adhesive has main properties that the tensile strength is 20 to 40 MPa, the elongation at break is 5 percent to 30 percent, the impact strength is 20 to 150 kJ / m2 and high-temperature glass transition temperature is 90 to 120 DEG C. The toughened epoxy adhesive disclosed by the invention has the advantages that excellent mechanical property and excellent toughness are obtained; the curing cross-linking density of the epoxy resin is improved, the high-temperature glass transition temperature of the epoxy adhesive is not reduced, and the high-temperature usage temperature of the adhesive is not reduced while the adhesive is toughened by utilization of the characteristics of catalyzing and curing epoxy functional groups by a tertiary amine group.
Owner:NANJING UNIV

Resin composition and preparation methods of prepreg, composite substrate and PCB (printed circuit board) substrate

The invention discloses a resin composition and preparation methods of a prepreg, a composite substrate and a PCB (printed circuit board) substrate. The resin composition comprises the following components in parts by weight: 20-30 parts of multifunctional epoxy resin, 50-78 parts of a modified acid anhydride, 10-22 parts of cyanate resin, 11-72 parts of a filler and 0.01-0.05 part of an accelerant. The preparation method of the prepreg comprises the following steps: mixing the resin composition with an organic solvent to obtain a resin solution, wherein the solid content by mass fraction in the resin solution is 50-65%; and immersing glass fiber cloth into the resin solution to obtain a preimpregnated material and then drying the preimpregnated material for manufacturing. The composite substrate is formed by stacking the prepregs according to a perdetermined number and pressing. The PCB substrate is formed by stacking the prepregs according to the perdetermined number, applying metal foils on double sides or single sides of the prepregs and pressing. The resin composition disclosed by the invention has the advantages of high heat resistance, low dielectric loss and significant cost advantage.
Owner:KUANG CHI INNOVATIVE TECH

High-crystallization silver powder, low-cost heterojunction silver paste and preparation method and application of high-crystallization silver powder and low-cost heterojunction silver paste

The invention discloses high-crystallization silver powder and low-cost heterojunction silver paste and a preparation method and application thereof.The preparation method comprises the steps that inorganic powder is subjected to surface smoothing treatment and then mixed with an anti-flocculating agent, a dispersing agent and water to obtain inorganic powder dispersion liquid, then the inorganic powder dispersion liquid is mixed with a reducing agent, a particle size control agent and water-soluble silver salt, and the high-crystallization silver powder and low-cost heterojunction silver paste is obtained. The surface of the inorganic powder is coated with a silver layer through a chemical reduction method, and therefore the silver-coated inorganic matter nanometer powder type high-crystallization ball-like silver powder is synthesized. According to the silver paste formula, the high-dispersity flaky silver powder is added to be matched with the high-crystallization silver powder, the conductivity of the silver paste is effectively improved, and meanwhile the fine printing performance of the silver paste is reserved.
Owner:SUZHOU BETELY POLYMER MATERIALS CO LTD +1
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