Halogen-free resin composition and cover film, copper-clad plate and printed wiring board prepared from same

A technology of resin composition and copper clad laminate, applied in the direction of epoxy resin glue, printed circuit parts, adhesive type, etc., can solve the problem of heat resistance, storage stability to be further improved, low transparency of rubber, easy to whiten And yellowing and other problems, to achieve the effect of high curing crosslinking density, high transparency and good storage stability

Inactive Publication Date: 2019-01-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the rubber itself has low transparency and is prone to whitening and yellowing
[0004] CN1294198C discloses a modified ethylene-vinyl alcohol copolymer obtained by reacting an ethylene-vinyl alcohol copolymer with a monovalent epoxy resin with a molecular weight below 500 as a toughened epoxy resin of a thermoplastic resin, which can improve barrier properties and transparency ; CN107400491A discloses a transparent epoxy adhesive, which includes cycloaliphatic epoxy resin, hexahydrophthalic anhydride, toughening agent and light-transmitting powder. It solves the problems of compatibility and yellowing resistance, and has high transparency, but it still needs to be further improved in terms of heat resistance and storage stability.

Method used

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  • Halogen-free resin composition and cover film, copper-clad plate and printed wiring board prepared from same
  • Halogen-free resin composition and cover film, copper-clad plate and printed wiring board prepared from same
  • Halogen-free resin composition and cover film, copper-clad plate and printed wiring board prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0057] Prepare a resin composition according to the components shown in Table 1, and dilute it with toluene and butanone as solvents to obtain a glue solution, and make a cover film sample according to the following cover film production method.

[0058] Use a coating machine to coat the halogen-free resin composition on a polyester film with a thickness of 25 μm, control the thickness of the glue (dry glue) to be 15 μm, and then bake it in a high-temperature test box at 140° C. for 2 minutes to form a polyester film. A partially cross-linked and cured adhesive layer is formed on the ester film, and then a release film is laminated with the adhesive layer to obtain a cover film for a flexible printed circuit board.

Embodiment 7-12

[0060] Prepare the resin composition by the components shown in table 1 (embodiment 7 uses the resin composition of embodiment 1, and embodiment 8 uses the resin composition of embodiment 2, and embodiment 9 uses the resin composition of embodiment 3, and embodiment 10 uses the resin composition of embodiment 4, and embodiment 11 uses the resin composition of embodiment 5, and embodiment 12 uses the resin composition of embodiment 6), and dilutes with toluene and methyl ethyl ketone as solvent, obtains glue solution, according to Copper-clad laminate samples were prepared as follows.

[0061] The halogen-free resin composition was coated on a 25 μm polyester film, and the thickness of the glue (dry glue) was controlled to be 15 μm. The polyester film coated with the halogen-free resin composition is placed in a 140°C high-temperature test box and baked for 2 minutes to semi-cure, and then a rolled copper film with a size of 40cm (length) × 25cm (width) × 18μm (thickness) Foil...

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Abstract

The invention provides a halogen-free resin composition and a cover film, a copper-clad plate and a printed wiring board prepared from the same. The halogen-free resin composition comprises, by weight, 70-90 parts of carboxyl-saturated polyester, 5-20 parts of polyacrylate, 3-15 parts of epoxy resin and 0.5-5 parts of blocked isocyanates. The carboxyl-saturated polyester and the polyacrylate are adopted as main resins, so that the resin composition is high in transparency and good in adhesion. The epoxy resin and the blocked isocyanates adopted as curing agents cooperate with each other to cure the carboxyl-saturated polyester and the polyacrylate, so that the resin composition has good storage stability and high curing and crosslinking density. The cover film prepared from the halogen-free resin composition is good in shape covering and high in visible light transmittance and peel strength. The copper-clad plate prepared from the halogen-free resin composition is also high in visiblelight transmittance and peel strength.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and relates to a halogen-free resin composition, a cover film, a copper-clad laminate and a printed circuit board prepared therefrom. Background technique [0002] Driven by the trend of thinner, lighter and wearable electronic products, the technology of flexible printed circuit boards is developing rapidly, and the requirements for the performance of flexible copper clad laminates and cover films are also becoming more and more diverse. Among them, the requirement of transparency has gradually become prominent in recent years, such as the backlight module involved in CN204513119U, the connection equipment between the display screen and the main board involved in CN203799313U, and the display module involved in CN206207131U. Components; CN103898498A, CN103582304A, etc. have mentioned the application of making transparent circuit boards with transparent copper clad laminates. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/00C09J133/04C09J163/00C09J11/06C09J7/30C09J7/25H05K1/03
CPCC08L2201/08C08L2201/10C08L2203/20C08L2205/03C09J7/25C09J7/255C09J7/30C09J11/06C09J167/00C09J2467/006C09J2479/086H05K1/03C08L33/04C08L63/00C08K5/29
Inventor 闫增阳张炜祺茹敬宏伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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