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Resin composition and application thereof

A resin composition and resin technology, applied in applications, epoxy resin adhesives, and other household appliances, can solve the problems of low metal-clad peel strength, low mechanical strength, and poor moldability of prepreg paving.

Active Publication Date: 2017-10-24
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problems of low metal-clad peel strength, low mechanical strength, poor moldability of prepreg laying and appearance of bubbles and bad glue spots in the composite material with high molecular weight unsaturated hydrocarbon as the main resin, and provide a A resin composition with high metal adhesion strength, high mechanical strength, good paving formability and good appearance is used in the production of composite materials

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] Weigh 20 parts by weight of dicyclopentadiene type polyfunctional epoxy resin, 8 parts by weight of MDI modified epoxy resin, 5 parts by weight of epoxy resin containing alicyclic ring, 40 parts by weight of polyphenylene ether, 8 parts by weight of bisphenol A Add cyanotype ester and 0.01 parts by weight of 2-methylimidazole (2-MI) into 122 parts by weight of butanone to form a resin solution with a solid content of 60%.

[0113] Use 8 sheets (200mm*200mm) of 7628 quartz cloth to immerse in the above resin solution for impregnation. Bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive sheet.

[0114] Superimpose and align the above 8 adhesive sheets, with a 35um copper foil on the top and bottom. In the vacuum press, according to the temperature of 210 ℃, the pressure of 25kgf / cm 2 Conditions, pressed for 160 minutes to make a double-sided copper clad laminate with a thickness of 1.6mm.

Embodiment 2

[0116] Take by weighing 35 parts by weight of o-phenyl phenolic type polyfunctional epoxy resin, 15 parts by weight of MDI modified epoxy resin, 10 parts by weight of epoxy resin containing alicyclic ring, 65 parts by weight of polyphenylene ether, 16 parts by weight of dicyclopentadiene Phenolic cyanate resin and 0.05 parts by weight of 2-methylimidazole (2-MI) were added to 212 parts by weight of butanone to form a resin solution with a solid content of 60%.

[0117] Use 8 sheets (200mm*200mm) of 7628 quartz cloth to immerse in the above resin solution for impregnation. Bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive sheet.

[0118] Superimpose and align the above 8 adhesive sheets, with a 35um copper foil on the top and bottom. In the vacuum press, according to the temperature of 210 ℃, the pressure of 25kgf / cm 2 Conditions, pressed for 160 minutes to make a double-sided copper clad laminate with a thickness of 1.6mm.

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PUM

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Abstract

The invention relates to a resin composition and application thereof. In particular, the invention relates to the resin composition. The resin composition comprises 20 to 35 parts by weight of multifunctional epoxy resin, 8 to 15 parts by weight of isocyanate modified epoxy resin, 5 to 10 parts by weight of bifunctional epoxy resin, 40 to 65 parts by weight of polyphenyl ether resin and 8 to 16 parts by weight of cyanate ester resin. The invention also relates to a product of the resin composition. The product of the resin composition comprises a resin film, a bonding sheet, a prepreg, a composite material, a laminated board and a printed circuit board. Through combination of different resin, superposition of product performance is realized, so that the product has good appearance and also has the comprehensive effects of heat resistance, low dielectric loss and easiness in processing.

Description

technical field [0001] The present invention relates to resin composition and its application. Background technique [0002] Polyphenylene ether resin has excellent dielectric properties due to its symmetrical molecular structure and low molecular dipole moment, and is favored by many workers engaged in new material development. The resin matrix with modified polyphenylene ether as curing agent has been widely used in composite substrates and high-frequency circuit boards. [0003] The resin composition of the prior art is: high molecular weight polybutadiene resin, containing more than 70wt% of vinyl, the weight average molecular weight MW is greater than 100000, accounting for 0-15wt% of composition weight; low molecular weight polybutadiene resin, containing More than 70wt% of vinyl groups have a weight-average molecular weight MW of 1000-10000, accounting for 10-40wt% of the weight of the composition; modified polyphenylene ether resins have a weight-average molecular w...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/40C08G59/38C08G59/32C08G59/20C08G59/24C08L63/00C09J163/00C09J7/00B32B15/14B32B27/04
CPCB32B15/14B32B2260/021B32B2260/046B32B2457/08C08G59/20C08G59/245C08G59/3218C08G59/38C08G59/4014C08G59/62C08J5/18C08J2363/00C08L63/00C08L2201/08C08L2203/16C08L2203/20C09J7/00C09J163/00
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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