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Double-amino-terminated active ester and preparation method thereof, and thermosetting resin composition and application thereof

A technology of resin composition and base active ester, which is applied in the preparation of amino hydroxy compounds, chemical instruments and methods, preparation of organic compounds, etc. Problems such as decreased adhesion between objects and metals

Active Publication Date: 2020-11-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing active ester cured epoxy resins also have deficiencies, for example, the crosslinking density of the cured resin is not high, and the macroscopic performance is low in heat resistance such as glass transition temperature (Tg)
In addition, compared with amine and phenolic resin curing agents, the bonding force between active ester cured products and metals is also significantly reduced.

Method used

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  • Double-amino-terminated active ester and preparation method thereof, and thermosetting resin composition and application thereof
  • Double-amino-terminated active ester and preparation method thereof, and thermosetting resin composition and application thereof
  • Double-amino-terminated active ester and preparation method thereof, and thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4 and comparative example 1-6

[0078] A thermosetting resin composition and a circuit board containing an epoxy resin (A) and a diamine compound (B) as essential components are prepared as follows: epoxy resin, double-terminated amino active ester or other curing agent, curing accelerator and solvent according to Mix a certain proportion in the solvent evenly (see the table below), control the solid content of the glue to 65%, impregnate the above glue with 2116 glass fiber cloth, control the appropriate thickness, and then bake in an oven at 145-175°C for 2-15 minutes Make a prepreg, then stack 6 pieces of prepreg together, stack 1Oz copper foil on the upper and lower sides, and cure at a curing temperature of 190°C to 200°C and a curing pressure of 30 to 60Kg / cm 2 , and the curing time is 90-120 minutes to make a circuit substrate. The specific composition, content and plate properties are shown in Table 1, and the raw material manufacturers and grades are shown in Table 2.

[0079]

[0080] Table 2 ...

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Abstract

The invention provides a double-terminal amino active ester and a preparation method thereof, and a thermosetting resin composition. The double-terminal amino active ester has a structure representedby a structural formula (I), wherein the main chain structure of the double-terminal amino active ester has aryl ester groups and aromatic amino functional groups at the same time. According to the invention, by using the double-terminal amino active ester as a curing agent for an epoxy resin, the thermosetting resin composition of the double-terminal amino active ester has a low dielectric constant, a low dielectric loss factor, good heat resistance and toughness and excellent bonding force with metal.

Description

technical field [0001] The present invention relates to a kind of double-terminated amino active ester useful as a component of a thermosetting resin composition, a preparation method of the double-terminated amino active ester, a thermosetting resin composition and its application, especially a kind of aromatic The active ester of ester group and aromatic amino functional group and its thermosetting resin composition, as well as cured products, semiconductor sealing materials, prepregs, circuit substrates and laminated films made of the thermosetting resin composition. Background technique [0002] In recent years, with the development of electronic information technology, miniaturization and high density of electronic equipment installation, large capacity and high frequency of information, more and more requirements have been put forward for the dielectric properties, water absorption and heat resistance of electronic materials. high demands. [0003] The material prepar...

Claims

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Application Information

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IPC IPC(8): C07C219/34C07C213/02C08G59/50C08J5/24C08L63/00
CPCC07C219/34C08G59/5033C08J5/24C08J2363/00C07C2603/68
Inventor 林伟奚龙黄天辉游江
Owner GUANGDONG SHENGYI SCI TECH
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