Diamine compound and preparation method thereof, and thermosetting resin composition and application thereof
A technology of resin composition and amine compound, applied in aromatic field, can solve the problems of low crosslinking density and low heat resistance performance of resin cured product
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[0072] A thermosetting resin composition containing epoxy resin (A) and diamine compound (B) as essential components and a circuit substrate thereof are prepared as follows: epoxy resin, diamine compound or other curing agents, fillers, and curing accelerators are mixed in a certain proportion Mix evenly in the solvent (see Table 1), control the solid content of the glue to 65%, impregnate the above glue with 7628 glass fiber cloth, control the appropriate thickness, and then bake it in an oven at 145-175°C for 2-15 minutes to make it Prepreg, then 8 prepregs are stacked together, and 1Oz copper foil is stacked on the upper and lower sides. The curing temperature is 190℃~200℃, and the curing pressure is 30~60Kg / cm 2 , and the curing time is 90-120 minutes to make circuit substrates. The specific components, content and board properties are shown in Table 1, and the raw material manufacturers and grades are shown in Table 2.
[0073] Table 1
[0074]
[0075] Table 2
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