Diamine compound and preparation method thereof, and thermosetting resin composition and application thereof

A technology of resin composition and amine compound, applied in aromatic field, can solve the problems of low crosslinking density and low heat resistance performance of resin cured product

Active Publication Date: 2020-11-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing active ester cured epoxy resins also have deficiencies, for example, the crosslinking density of the cured resin is not high, and the macroscopic performance is low in heat resistance such as glass transition temperature (Tg)

Method used

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  • Diamine compound and preparation method thereof, and thermosetting resin composition and application thereof
  • Diamine compound and preparation method thereof, and thermosetting resin composition and application thereof
  • Diamine compound and preparation method thereof, and thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4 and comparative example 1-5

[0072] A thermosetting resin composition containing epoxy resin (A) and diamine compound (B) as essential components and a circuit substrate thereof are prepared as follows: epoxy resin, diamine compound or other curing agents, fillers, and curing accelerators are mixed in a certain proportion Mix evenly in the solvent (see Table 1), control the solid content of the glue to 65%, impregnate the above glue with 7628 glass fiber cloth, control the appropriate thickness, and then bake it in an oven at 145-175°C for 2-15 minutes to make it Prepreg, then 8 prepregs are stacked together, and 1Oz copper foil is stacked on the upper and lower sides. The curing temperature is 190℃~200℃, and the curing pressure is 30~60Kg / cm 2 , and the curing time is 90-120 minutes to make circuit substrates. The specific components, content and board properties are shown in Table 1, and the raw material manufacturers and grades are shown in Table 2.

[0073] Table 1

[0074]

[0075] Table 2

[00...

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Abstract

The invention provides a diamine compound and a preparation method thereof, and a thermosetting resin composition, wherein the diamine compound has a structure represented by a structural formula (I),and the diamine compound structurally has aromatic amino and aromatic ester functional groups at the same time. By using the diamine compound as a curing agent for an epoxy resin, the thermosetting resin composition of the diamine compound has a low dielectric constant, a low dielectric loss factor, good heat resistance, toughness and excellent bonding force with metal.

Description

technical field [0001] The present invention relates to a diamine compound useful as a component of a thermosetting resin composition, a preparation method of the diamine compound, a thermosetting resin composition and its use, especially to a diamine compound having both an aromatic amine group and an aryl ester group in its structure A functional group diamine compound and its thermosetting resin composition, as well as a cured product made of the thermosetting resin composition, a semiconductor sealing material, a prepreg, a circuit substrate, and a laminated film. Background technique [0002] In recent years, with the development of electronic information technology, miniaturization and high density of electronic equipment installation, large capacity and high frequency of information, more and more requirements have been put forward for the dielectric properties, water absorption and heat resistance of electronic materials. high demands. [0003] The material prepared...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C229/60C07C227/04C08L63/00C08G59/50C08J5/24C08K7/14C09D163/00B32B17/04B32B17/12B32B17/06B32B15/20B32B27/04B32B27/18B32B27/26B32B27/38B32B37/06B32B37/10H05K1/05H01L23/29
CPCC07C229/60C08L63/00C08G59/504C08J5/24C09D163/00B32B5/02B32B5/26B32B15/14B32B15/20B32B37/06B32B37/10H01L23/293H01L23/295H01L23/296H05K1/056C07C2603/68C08J2363/00C08K7/14B32B2250/40B32B2260/023B32B2260/046B32B2262/101B32B2307/20B32B2307/306B32B2307/726B32B2307/554B32B2457/08
Inventor 林伟奚龙黄天辉游江
Owner GUANGDONG SHENGYI SCI TECH
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