Epoxy resin daub for building joint filling and preparation method thereof
A technology of epoxy resin cement and epoxy resin, which is applied in the field of caulking cement, can solve the problems of insufficient mechanical properties of caulking glue, cumbersome preparation process of caulking glue, and short service life, so as to achieve good deformability and improve The effect of strength and good elongation at break
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[0065] A preparation method of epoxy resin cement for building joints, comprising the steps of:
[0066] Step S1, drop methyl hexahydrophthalic anhydride and 2,4,6-tris(dimethylaminomethyl)phenol into the bisphenol A type 128 epoxy resin, stir for 20 minutes and put it in a vacuum oven at 60°C for defoaming , take it out after finding that there is no obvious bubble overflow in the mixed liquid;
[0067] Wherein, the mass ratio of bisphenol A type 128 epoxy resin, methyl hexahydrophthalic anhydride and 2,4,6-tris(dimethylaminomethyl)phenol is 10:0.3-0.4:0.1-0.15;
[0068] Step S2, adding polyimide resin therein, stirring for 15-18 minutes, then adding carboxy-terminated nitrile rubber, stirring for 15-18 minutes to obtain the first mixture;
[0069] Step S3, after uniformly mixing the modified epoxy resin and the coupling agent, adding modified carbon nanotubes and fillers, and ultrasonically dispersing to obtain a second mixture;
[0070] Step S4, thoroughly mix the first m...
Embodiment 1
[0075] An epoxy resin mastic for building joints, comprising component A and component B, the component A is made of the following main parts by weight of raw materials: 45 parts of bisphenol A type 128 epoxy resin, modified epoxy resin 15 parts, 10 parts of carboxy-terminated nitrile rubber, 10 parts of polyimide resin, 8 parts of modified carbon nanotubes, 12 parts of filler, 1 part of KH550 silane coupling agent;
[0076] The component B includes low temperature curing agent, polyamide curing agent, phenalkamine curing agent, dibutyl phthalate, low temperature curing agent, polyamide curing agent, phenalkamine curing agent and dibutyl phthalate The mass ratio is 10:2:5:0.5;
[0077] The mass proportioning of described component A and component B is 10:2;
[0078] The filler is formed by compounding talc powder, mica powder and carbon black according to the mass ratio of 10:6:2;
Embodiment 2
[0080] An epoxy resin mastic for building joints, comprising component A and component B, the component A is made of the following main parts by weight: 50 parts of bisphenol A type 128 epoxy resin, modified epoxy resin 18 parts, 12 parts of carboxy-terminated nitrile rubber, 13 parts of polyimide resin, 9 parts of modified carbon nanotubes, 14 parts of filler, 1.5 parts of KH560 silane coupling agent;
[0081] The component B includes low temperature curing agent, polyamide curing agent, phenalkamine curing agent, dibutyl phthalate, low temperature curing agent, polyamide curing agent, phenalkamine curing agent and dibutyl phthalate The mass ratio is 10:2.5:6:0.8;
[0082] The mass proportioning of described component A and component B is 10:2.5;
[0083] The filler is formed by compounding talcum powder, mica powder and carbon black according to the mass ratio of 10:7:3;
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