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Acid resistance type protective ink and preparation method thereof

An acid type and ink technology, applied in the chemical industry, can solve the problems of easy corrosion of touch screen circuits, poor hydrofluoric acid resistance, and the generation of a large amount of waste alkali water, so as to improve the hydrofluoric acid resistance, high curing efficiency, The effect of increasing the curing crosslink density

Active Publication Date: 2015-08-19
国科广化(南雄)新材料研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the patents "UV glass protection ink" (application number: 201110424007.2), "glass protection ink and its preparation method" (application number: 201210274017.7) introduced the technology of preparing protective ink with modified acrylic resin as the main body, but such protection The ink needs to use alkaline aqueous solution (NaOH aqueous solution) in the stripping process, which is easy to corrode the touch screen circuit, has poor hydrofluoric acid resistance, complex stripping process, difficult cleaning and produces a large amount of waste alkaline water, polluting the environment and posing safety hazards

Method used

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  • Acid resistance type protective ink and preparation method thereof
  • Acid resistance type protective ink and preparation method thereof
  • Acid resistance type protective ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add 100 grams (0.61mol) of phenolic epoxy resin (NPPN-638S), 0.2 grams of triphenylphosphine, and 0.26 grams of hydroquinone into the reactor. The temperature is raised to 110°C, and 38.2 grams (0.53mol) of AA and 219.5 The mixed solution of gram (1.06 mol) AMPS was slowly and continuously dripped with a constant pressure funnel for 60 minutes, and after the dripping was completed, it was kept at 115° C. for 2 hours to obtain a novolac epoxy acrylic resin.

[0030] Weigh the following parts by weight: 50 parts of phenolic epoxy acrylic resin, 20 parts of 1,6-hexanediol diacrylate, 5 parts of 1-hydroxycyclohexyl phenyl ketone, 15 parts of talc, and 10 parts of barium sulfate , 0.5 parts of defoamer. The epoxy acrylic resin is mixed with the active diluent, mixed with the photoinitiator, filler, and defoamer. After high-speed stirring, a uniform viscous liquid is formed. The viscous liquid is ground in a grinder to obtain a protective ink product.

Embodiment 2

[0032] Add 100 grams (0.61mol) of phenolic epoxy resin (NPPN-638S), 0.2 grams of triphenylphosphine, and 0.26 grams of hydroquinone into the reactor. The temperature is raised to 110°C, and 38.2 grams (0.53mol) of AA and 219.5 The mixed solution of gram (1.06 mol) AMPS was slowly and continuously dripped with a constant pressure funnel for 60 minutes, and after the dripping was completed, it was kept at 115° C. for 2 hours to obtain a novolac epoxy acrylic resin.

[0033] Weigh the following parts by weight: 50 parts of phenolic epoxy acrylic resin, 20 parts of hydroxypropyl methacrylate, 5 parts of 1-hydroxycyclohexyl phenyl ketone, 15 parts of talc, 10 parts of barium sulfate, defoamer 0.5 copies. The epoxy acrylic resin is mixed with the active diluent, mixed with the photoinitiator, filler, and defoamer. After high-speed stirring, a uniform viscous liquid is formed. After the viscous liquid is ground in a grinder, the finished protective ink is obtained.

Embodiment 3

[0035] Add 100 grams (0.61mol) of phenolic epoxy resin (NPPN-638S), 0.2 grams of triphenylphosphine, and 0.26 grams of hydroquinone into the reactor. The temperature is raised to 110°C, and 38.2 grams (0.53mol) of AA and 219.5 The mixed solution of gram (1.06 mol) AMPS was slowly and continuously dripped with a constant pressure funnel for 60 minutes, and after the dripping was completed, it was kept at 115° C. for 2 hours to obtain a novolac epoxy acrylic resin.

[0036] Weigh the following parts by weight: 50 parts of novolac epoxy acrylic resin, 20 parts of 1,6-hexanediol diacrylate, 2-methyl-1-[4-(methylthio)phenyl]-2- 6 parts of morpholinyl-1-acetone, 3 parts of isopropyl thioxanthone, 15 parts of talc, 10 parts of barium sulfate, 0.5 parts of defoamer. The epoxy acrylic resin is mixed with the active diluent, mixed with the photoinitiator, filler, and defoamer. After high-speed stirring, a uniform viscous liquid is formed. After the viscous liquid is ground in a grinder, th...

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Abstract

The invention discloses acid resistance type protective ink and a preparation method thereof. Phenolic epoxy acrylic resin which comprises a multi-reaction functional group and a hydrophilic group is synthesized, the screening of filling materials, a defoaming agent and other additives is integrated with the phenolic epoxy acrylic resin as a main body, and the acid resistance type protective ink with the good hydrofluoric acid resistance and the dehydration effect is prepared. According to the acid resistance type protective ink and the preparation method thereof, the superior adhesion is presented on OGS (One Glass Solution) touch screen glass, the time of the resistance to the 20% of hydrofluoric acid can reach more than 30 minutes, the film stripping can be achieved through the ordinary hot water, the harm to the glass is not produced, a protective film falls off in a flaked mode during film stripping, the filtration and the separation are easy, the degree of automation of the process is high, and the safe and environment-friendly effect is achieved.

Description

Technical field [0001] The invention relates to the field of chemical engineering, in particular to an acid-resistant protective ink and a preparation method thereof. Background technique [0002] The touch screen is an inductive liquid crystal display device that can receive input signals such as contacts, and is mainly used in smart phones, tablet computers, industrial control and other fields. Under the trend of thinning and low cost, one-glass solution (OGS) touch screen has become the mainstream touch technology in the market. The hydrofluoric acid strengthening process of the OGS touch screen manufacturing process requires the use of an anti-hydrofluoric acid film to protect the touch screen circuit. Although the protective performance of the hydrofluoric acid film is superior, the application precision is extremely high and the process is complicated. When removing, it is necessary to manually tear and remove each hydrofluoric acid film, which is low in production efficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/03C08G59/17C08G59/14
CPCC08G59/1466C08G59/1483C09D11/03C09D11/101C09D11/107
Inventor 吴昆罗志有曹昕史珺梁利岩黄晓梅吕满庚
Owner 国科广化(南雄)新材料研究院有限公司
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