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Resin composition and preparation methods of prepreg, composite substrate and PCB (printed circuit board) substrate

A resin composition and prepreg technology, applied in chemical instruments and methods, circuit substrate materials, synthetic resin layered products, etc., can solve the problems of complex production synthesis process, excellent composite substrate, high production cost, etc., and achieve significant cost Advantages, improved heat resistance, high curing crosslinking density effect

Inactive Publication Date: 2015-04-29
KUANG CHI INNOVATIVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cyanate resin as the matrix has been widely used in composite substrates and high-frequency circuit boards. Due to the complex production and synthesis process and harsh conditions of cyanate ester, its production cost is high. The commercially available bisphenol A type cyanate resin It has already exceeded 600.0RMB / kg. This price has caused heavy cost pressures on large-scale mass-produced composite substrates or circuit substrate manufacturers, and the use of cyanate resin in the resin composition will also lead to composite substrates. Too hard or too brittle

Method used

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  • Resin composition and preparation methods of prepreg, composite substrate and PCB (printed circuit board) substrate

Examples

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Embodiment 1

[0024] Take by weighing the dicyclopentadiene phenol type polyfunctional epoxy resin of 26 parts by weight, the styrene-modified maleic anhydride of 50 parts by weight, the bisphenol A type cyanate resin of 10 parts by weight, the purity of 11 parts by weight ≥ 98% quartz powder, the 2-methylimidazole (2-MI) of 0.01 weight part, join in the butanone of 65 weight parts and be made into the resin solution that solid content is 60%, promptly in the resin solution, each component The mass ratio is: dicyclopentadiene phenolic multifunctional epoxy resin: styrene modified maleic anhydride: bisphenol A cyanate resin: quartz powder: 2-methylimidazole: butanone=26:50:10 :11:0.01:65. Use 8 sheets (250mm*250mm) of 7628 quartz cloth to immerse in the above resin solution for impregnation. Bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive sheet. The gelling time (G-T) of the adhesive sheet is 105±15 seconds (171 ℃), the fluidity is 25±5%....

Embodiment 2

[0026] Weigh 26 parts by weight of biphenyl type epoxy resin, 78 parts by weight of styrene-modified maleic anhydride, 22 parts by weight of o-cresol type polyfunctional cyanate resin, 72 parts by weight of the purity ≥ 98% The 2-ethyl-4-methylimidazole of quartz powder, 0.03 weight part, join in the acetone of 132 weight parts and be made into the resin solution that solid content is 60%, namely in the resin solution, the mass ratio of each component is: Biphenyl type epoxy resin: styrene modified maleic anhydride: o-cresol type polyfunctional cyanate resin: quartz powder: 2-ethyl-4-methylimidazole: acetone=26:78:22:72: 0.03:132. Dip 8 sheets (250mm*250mm) of 7628 quartz cloth into the above resin solution for impregnation, and bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive. For splicing, the gel time (G-T) of the adhesive sheet is 105±15 seconds (171°C), and the fluidity is 25±5%. Superimpose and align the above 8 adhesi...

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Abstract

The invention discloses a resin composition and preparation methods of a prepreg, a composite substrate and a PCB (printed circuit board) substrate. The resin composition comprises the following components in parts by weight: 20-30 parts of multifunctional epoxy resin, 50-78 parts of a modified acid anhydride, 10-22 parts of cyanate resin, 11-72 parts of a filler and 0.01-0.05 part of an accelerant. The preparation method of the prepreg comprises the following steps: mixing the resin composition with an organic solvent to obtain a resin solution, wherein the solid content by mass fraction in the resin solution is 50-65%; and immersing glass fiber cloth into the resin solution to obtain a preimpregnated material and then drying the preimpregnated material for manufacturing. The composite substrate is formed by stacking the prepregs according to a perdetermined number and pressing. The PCB substrate is formed by stacking the prepregs according to the perdetermined number, applying metal foils on double sides or single sides of the prepregs and pressing. The resin composition disclosed by the invention has the advantages of high heat resistance, low dielectric loss and significant cost advantage.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a method for preparing a resin composition, a prepreg, a composite base material and a PCB base material. Background technique [0002] Cyanate resin is favored by many workers engaged in new material development because of its excellent high temperature resistance and dielectric properties. Cyanate resin as the matrix has been widely used in composite substrates and high-frequency circuit boards. Due to the complex production and synthesis process and harsh conditions of cyanate ester, its production cost is high. The commercially available bisphenol A type cyanate resin It has already exceeded 600.0RMB / kg. This price has caused heavy cost pressures on large-scale mass-produced composite substrates or circuit substrate manufacturers, and the use of cyanate resin in a large proportion in the resin composition will also lead to composite substrates. The material is too hard or to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/40C08G59/42C08K7/14C08J5/24B32B15/092B32B27/04B32B37/10H05K1/03
Inventor 不公告发明人
Owner KUANG CHI INNOVATIVE TECH
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