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Resin composition, prepreg, laminated board and printed wiring board

A resin composition and prepreg technology, applied in printed circuits, printed circuit parts, layered products, etc., to achieve the effect of tight cross-linked structure, reduced dielectric constant and dielectric loss value, and increased cross-linked network structure

Active Publication Date: 2022-03-25
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the above-mentioned resin system is used to prepare high-performance substrates for high-frequency and high-speed applications, in order to improve heat resistance, thermal expansion coefficient or flame retardancy, it is necessary to add bismaleimide resin, benzoxazine resin, etc. to the resin composition. Other components such as resin or phosphorus-containing flame retardant, so the dielectric constant of the final substrate material still cannot meet the requirements of high-frequency and high-speed substrates

Method used

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  • Resin composition, prepreg, laminated board and printed wiring board
  • Resin composition, prepreg, laminated board and printed wiring board
  • Resin composition, prepreg, laminated board and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0041] Take the preparation of the active ester compound containing butadiene group as an example below, and its reaction mechanism is as follows:

[0042]

[0043] Of course, it is not limited to this, other methods can also be used to prepare active ester compounds as shown in structural formula (1) and structural formula (2), that is, all can be prepared as shown in structural formula (1) and structural formula (2) The preparation methods of the active ester compounds shown are all within the protection scope of the present invention.

[0044] Further, the epoxy resin is selected from bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, phosphorus-containing epoxy resin, nitrogen-containing epoxy resin Resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, biphenyl type Epoxy resin, n...

Synthetic example 1

[0105] Take butadienyl phenol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly, at the temperature of 50°C, feed nitrogen at the same time, add tetrabutylammonium bromide catalyst, and then slowly drop in concentration 20% aqueous sodium hydroxide solution, reacted for 2.5 hours, then added phenol, continued to react for 1 hour, after the reaction was completed and washed several times, dried for 3 hours under vacuum at 80°C to obtain the active ester compound A, Wherein, the active ester compound A is an active ester compound shown in structural formula (1), and its chemical structural formula is as follows:

[0106]

Synthetic example 2

[0108] Take pentadienyl phenol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly. 20% aqueous sodium hydroxide solution, reacted for 2.5 hours, then added p-vinylphenol, continued to react for 0.5 hours, after the reaction was completed and washed several times, dried under vacuum conditions at 80°C for 3 hours to obtain the active ester compound B, wherein, described active ester compound B is the active ester compound shown in structural formula (1), and its chemical structural formula is as follows:

[0109]

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PUM

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Abstract

Compared with the existing resin composition, the resin composition provided by the invention has the advantages of higher glass transition temperature, high heat resistance, high toughness and favorable dielectric property; the invention also provides a prepreg, an insulating film, a metal foil-coated laminated board and a printed circuit board which are prepared by using the resin composition.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition, a prepreg, a laminate, and a printed circuit board prepared therefrom. Background technique [0002] With the upgrading of technology, the automotive market, smart phones and other consumer electronics markets have put forward new requirements for PCBs. In 2018, with the commercial launch of 5G, the requirements for the dielectric properties of PCB substrates are higher. High-frequency and high-speed copper-clad laminates are one of the indispensable electronic substrates in the 5G era. To put it simply, the PCB substrate material needs to have a lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, it is desired to provide a thermosetting resin composition, and the printed circuit board made by using the thermosetting res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/36C08K7/14C08J5/24C08G59/42B32B17/02B32B17/12B32B17/06B32B15/20H05K1/03
CPCC08K9/06C08K3/36C08J5/24C08G59/4223B32B5/02B32B5/26B32B15/20B32B15/14H05K1/0373H05K1/0366H05K1/036B32B2260/021B32B2260/046B32B2262/101B32B2307/306B32B2307/558B32B2457/08C08J2363/00C08K7/14C08L63/00
Inventor 崔春梅杨宋戴善凯黄荣辉谌香秀
Owner SHENGYI TECH SUZHOU
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