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Resin composition, prepreg, laminated board and printed wiring board

A technology of resin composition and prepreg, which is applied in the fields of printed circuit boards, prepregs, and resin compositions containing modified active ester compounds, to achieve the effect of increasing the cross-linked network structure, reducing the dielectric loss value and improving the brittleness problem

Active Publication Date: 2022-03-25
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the above-mentioned resin system is used to prepare high-performance substrates for high-frequency and high-speed applications, in order to improve heat resistance, thermal expansion coefficient or flame retardancy, it is necessary to add bismaleimide resin, benzoxazine resin, etc. to the resin composition. Other components such as resin or phosphorus-containing flame retardant, so the dielectric constant of the final substrate material still cannot meet the requirements of high-frequency and high-speed substrates

Method used

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  • Resin composition, prepreg, laminated board and printed wiring board
  • Resin composition, prepreg, laminated board and printed wiring board
  • Resin composition, prepreg, laminated board and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0046] Take the preparation of the active ester compound containing butadiene group as an example below, and its reaction mechanism is as follows:

[0047]

[0048]Of course, it is not limited to this, other methods can also be used to prepare active ester compounds as shown in structural formula (1) and structural formula (2), that is, all can be prepared as shown in structural formula (1) and structural formula (2) The preparation methods of the active ester compounds shown are all within the protection scope of the present invention.

[0049] Further, the epoxy resin is selected from bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, phosphorus-containing epoxy resin, nitrogen-containing epoxy resin Resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, triphenylmethane epoxy resin, tetraphenylethane epoxy resin, biphenyl type Epoxy resin, na...

Synthetic example 1

[0116] Take butadiene-based bisphenol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly. The concentration is 20% sodium hydroxide aqueous solution, react for 2.5 hours, then add phenol, continue to react for 1 hour, after the reaction is completed and after several times of washing, dry under vacuum conditions at 80°C for 3 hours to obtain the active ester compound A , its chemical structure is as follows:

[0117]

Synthetic example 2

[0119] Take pentadienyl phenol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly. 20% aqueous sodium hydroxide solution, reacted for 2.5 hours, then added p-vinylphenol, continued to react for 0.5 hours, after the reaction was completed and washed several times, dried under vacuum conditions at 80°C for 3 hours to obtain the active ester compound B, its chemical structural formula is as follows:

[0120]

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PUM

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Abstract

The invention discloses a resin composition, a prepreg, a laminated board and a printed wiring board, and the resin composition mainly comprises epoxy resin, a maleimide compound and an active ester compound containing a carbon-carbon unsaturated group. The epoxy resin and the maleimide compound are mixed for use, so that the crosslinking density of the cured product is further improved, and the whole curing crosslinking system is tighter, therefore, the dielectric constant and dielectric loss of the cured product are further reduced, and meanwhile, the toughness of the cured product is effectively improved. Experimental data prove that the resin composition and the prepreg, the laminated board and the printed circuit board prepared from the resin composition can meet the requirements of current 5G products.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition containing a modified active ester compound, a prepreg, a laminate, and a printed circuit board prepared therefrom. Background technique [0002] With the upgrading of technology, the automotive market, smart phones and other consumer electronics markets have put forward new requirements for PCBs. In 2018, with the commercial launch of 5G, the requirements for the dielectric properties of PCB substrates are higher. High-frequency and high-speed copper-clad laminates are one of the indispensable electronic substrates in the 5G era. To put it simply, the PCB substrate material needs to have a lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, it is desired to provide a thermosetting resin composition, the printed wiring bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/08C08L9/00C08K9/06C08K7/18B32B17/04B32B15/14B32B15/20B32B33/00
CPCC08L63/00C08K9/06C08K7/18B32B5/02B32B15/14B32B15/20B32B33/00B32B2262/101B32B2255/02B32B2255/26B32B2307/204B32B2307/558B32B2307/306B32B2457/08C08L9/00C08L63/08
Inventor 崔春梅何继亮马建任科秘王宁
Owner SHENGYI TECH SUZHOU
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