Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive

A technology of insulating paper and adhesives, applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve the problems of transformers, motors, electrical products, hidden dangers in quality, difficulty in meeting the requirements of transformers, and decrease in bonding strength. , to achieve excellent cohesiveness and storage, large market application value, and improved cohesive strength

Active Publication Date: 2021-02-02
西安西电电工材料有限责任公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the bonding strength of phenolic resin type dispensing paper is lower than that of epoxy resin dispensing paper, it was widely used as a mainstream product when the transformer capacity was small and the motor voltage level was low. With the increase of transformer capacity, With the improvement of motor voltage level and the development of motor and electrical products in the direction of high voltage, long life and high reliability, the safety requirements for motor and electrical products are also getting higher and higher, and the requirements for the adhesive strength as an important performance of dispensing paper It is also getting higher and higher. Due to the lower bond strength, it is more and more difficult to meet the use requirements of transformers or electrical appliances, and the phenolic resin type dispensing paper is gradually eliminat

Method used

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  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive
  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive
  • Adhesive for diamond lattice dispensing insulation paper and preparation method of adhesive

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027]A preparation method of an adhesive for rhombic dispensing insulating paper, specifically:

[0028]First start the stirring, add 6.2%-7.1% solvent in the reaction kettle, slowly add 2.5%-3.1% curing agent A, stir for 5 minutes, slowly add 8.0%-9.0% epoxy resin A, stir After 10 minutes, the steam is turned on and the temperature is increased. The mixture is heated to 110°C within 20-60 minutes and the steam is turned off. In the reflux state, the temperature of 110°C-130°C is kept for about 60-90 minutes and then sampling is started to measure the molding time. (160±2℃, small knife method, 2g sample), if the molding time reaches 9 minutes-14 minutes (160±2℃, small knife method), turn off the steam and lower the temperature to below 100℃ and slowly add 20%-23 by mass % Epoxy resin B, then keep it at 90-100°C for 30 minutes, after the glue becomes clear, release the vacuum, turn off the steam and cool down to below 60°C, slowly add 11.2%-13% epoxy resin C, mass The percentage is 1.1...

Example Embodiment

[0036]Example 1

[0037]First start the stirring, add 6.2% by mass of xylene to the reactor, slowly add 2.5% of the curing agent DDM, stir for 5 minutes, slowly add 8.0% of E51 epoxy resin, stir for 10 minutes and then turn on the steam to increase the temperature. Close the steam inlet valve when the mixture is heated to 110°C within 20 minutes. In the reflux state, the temperature will be kept at 130°C for about 60 minutes and then start sampling to measure the forming time (160±2°C, knife method, 2 g sample), and shape The time is 11 minutes. If the process requirements are met, close the steam inlet valve, reduce the material temperature to below 100℃, slowly add 23% E12 epoxy resin by mass, and then properly open the steam inlet valve to keep the material at 100℃ for 30 minutes After the glue becomes clear, close the steam inlet valve, and slowly add 11.2% F53 epoxy resin, 1.1% modified amine latent curing agent and 48% acetone by weight when the temperature is below 60°C. After s...

Example Embodiment

[0038]Example 2

[0039]First start stirring, add 7.1% by mass solvent butanol to the reactor, slowly add 3.1% curing agent m-phenylenediamine, stir for 5 minutes, slowly add 9.0% EF180 epoxy resin A, stir for 10 minutes Turn on the steam to increase the temperature, and close the steam inlet valve when the mixture is heated to 110°C within 60 minutes. In the reflux state, after the reaction is kept at 120°C for about 60 minutes, start sampling to measure the molding time (160±2°C, knife method, 2g sample), the molding time is 11 minutes, and the process requirements are met, then close the steam inlet valve, reduce the material temperature to below 100 ℃, slowly add 20% E20 epoxy resin, and then properly open the steam inlet valve to keep the material in Keep the temperature at 90°C for 30 minutes. After the glue becomes clear, close the steam inlet valve, and slowly add 13% F51 epoxy resin and 1.6% boron trifluoride ethylamine complex by weight to below 60°C. Curing agent, mass perce...

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Abstract

The invention discloses an adhesive for diamond-grid dispensing insulation paper and a preparation method of the adhesive, and the adhesive comprises the following raw materials in percentage by mass:6.2%-7.1% of a solvent, 2.5%-3.1% of a curing agent A, 8.0%-9.0% of epoxy resin A, 20%-23% of epoxy resin B, 11.2%-13% of epoxy resin C, 1.1%-1.6% of a curing agent B and 44%-48% of acetone, whereinthe curing agent A is DDM, DDS or m-phenylenediamine; the curing agent B is dicyandiamide, a modified amine latent curing agent or a boron trifluoride ethylamine complex; the epoxy resin A is E44 epoxy resin, E51 epoxy resin or EF180 epoxy resin; the epoxy resin B is o-cresol formaldehyde epoxy resin, E20 epoxy resin or E12 epoxy resin; and the epoxy resin C is F44 novolac epoxy resin, F51 novolacepoxy resin or F53 novolac epoxy resin. Dispensing paper produced by adopting the adhesive prepared by the invention has the characteristics of high bonding strength and good storage performance, andhas good application prospect and economic benefit.

Description

technical field [0001] The invention belongs to the field of rhombic dispensing insulating paper, and in particular relates to an adhesive for rhombic dispensing insulating paper and a preparation method thereof. Background technique [0002] Lingge dispensing insulating paper is widely used in interlayer insulation and interturn insulation of oil-immersed power transformers. When in use, the coating layer begins to melt at a certain temperature during the coil drying process, resulting in adhesion. It rises and starts to solidify again, so that the adjacent layers of the winding are reliably bonded into a fixed unit. Due to the bonding of epoxy resin, the displacement of each layer of the winding during short circuit can be prevented, thereby ensuring the electrical and mechanical properties of the insulation structure. Because the resin coating of the rhombic dispensing paper is in the form of dots, it ensures the immersion of oil and the removal of gas in the insulating m...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04
CPCC09J163/00C09J163/04C08L2205/025C08L2205/03C08L63/00C08L63/04
Inventor 杜超云王战强贺旭芝
Owner 西安西电电工材料有限责任公司
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