Vernier-based double-sided PCB detection module and alignment method

Abstract

The invention discloses a vernier-based double-sided PCB detection module and an alignment method. The PCB detection module is provided with a first surface, a second surface and a dielectric materialclamped between the first surface and the second surface, and the first surface and the second surface are made of a copper material; at least one vernier area is arranged at the opposite positions of the first surface and the second surface. A hollow hole is formed in a first position in the vernier area; the first surface is provided with a hollow hole, offset marks are arranged on the two sides of the first position along a straight line with the hollow hole as the center, the offset marks are also hollow holes, the distance X between every two adjacent offset marks on the first face is equal, the distance Y between every two adjacent offset marks on the second face is equal, and the distance X is different from the distance Y. The layer deviation of the first surface and the second surface of the PCB detection module can be measured without using other external detection equipment, the measurement cost is low and the working efficiency is high.

Description

Technical field [0001] The invention relates to the field of PCB board measurement, in particular to a cursor-based double-sided PCB detection module and an alignment method. Background technique [0002] With the development of PCB boards to high-level and high-precision, the requirements for the accuracy of PCB board interlayer alignment are becoming more and more stringent, and the problem of PCB board layer deviation has attracted more and more attention. The PCB layer bias refers to the difference in concentricity between the layers of the PCB that originally required alignment. The scope of the requirements is controlled according to the design requirements of different PCB board types. The smaller the distance between the holes and the copper, the stricter the control is to ensure Its conduction and overcurrent capability. In the production process, the commonly used method to detect layer deviation is to add a set of concentric circles at the four corners of the PCB. Set...

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Problems solved by technology

[0003] However, the above detection methods require high equipment, high production costs, and X-ray radiation hazards; therefore, a new device for detecting layer deviation is urgently needed on the market to solve the above problems

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