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Design method of surface acoustic wave chip for enhancing standing wave sound field characteristics

A technology of surface acoustic wave and sound field characteristics, applied in electrical components, impedance networks, etc., can solve problems such as lack of application research, and achieve the effect of breaking through limitations

Pending Publication Date: 2020-07-14
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although there are many research results on artificial acoustic ultrastructure (metamaterials) in recent years, there is a lack of application research specific to a certain field.

Method used

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  • Design method of surface acoustic wave chip for enhancing standing wave sound field characteristics
  • Design method of surface acoustic wave chip for enhancing standing wave sound field characteristics
  • Design method of surface acoustic wave chip for enhancing standing wave sound field characteristics

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Embodiment Construction

[0040] The present invention will be further described below in conjunction with the examples.

[0041] The following examples are used to illustrate the present invention, but cannot be used to limit the protection scope of the present invention. The conditions in the embodiment can be further adjusted according to the specific conditions, and the simple improvement of the method of the present invention under the premise of the concept of the present invention belongs to the protection scope of the present invention.

[0042] It should be noted that, in the description of the invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. Orientation or positional relationship, which is only for convenience of description, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a ...

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Abstract

The invention discloses a design method of a surface acoustic wave chip for enhancing standing wave sound field characteristics. On the basis of determining a comparison test experiment of a surface acoustic wave device of a common piezoelectric substrate material, a sound field enhancement experiment scheme of a copper cylinder array microstructure is constructed; a multi-parameter adjustment rule of an acoustic copper cylinder array microstructure based on acoustic surface wave signal control is obtained through the experiment; data recording and analysis are carried out; an acoustic surfacewave model is constructed based on the acoustic copper cylinder array microstructure; a sound wave frequency control simulation experiment is carried out; analysis results are obtained via computation, a change rule of multi-parameter adjustment and sound field distribution characteristics is obtained; a device having a surface acoustic wave chip of a copper column array microstructure having sound field enhancement effect is processed and manufactured; different copper column intervals and different copper column arrays have different sound field regulation and enhancement effects, multi-scale and multifunctional microfluidic requirements are met, a surface acoustic wave sound field is effectively regulated, and the surface acoustic wave chip is customized as required.

Description

technical field [0001] The invention belongs to the field of artificial acoustic microstructure design, and in particular relates to a design method of a surface acoustic wave chip that enhances the sound field characteristics of standing waves. Background technique [0002] Acoustic microstructures (including acoustic metamaterials) are one of the frontier research hotspots in physics in recent years. It can provide unprecedented and more flexible control of sound waves, and the novel propagation law in acoustic microstructures has opened up new ideas for the study of arbitrary frequency control of sound wave signals, which also provides SAW chips with multi-functional and multi-scale microstructures. Fluidic applications show bright prospects, such as the adjustable characteristics of the internal sound field of the surface acoustic wave chip for particle shunting, cell sorting and other fields. Therefore, how to design the acoustic copper pillar array microstructure acco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/25
CPCH03H9/25
Inventor 韩建宁唐帅杨鹏张赛温廷敦
Owner ZHONGBEI UNIV