Gold thread detection method for a packaged chip

Abstract

The invention discloses a gold thread detection method for a packaged chip. The gold thread detection method comprises the following steps: S1, collecting a standard chip graph; S2, extracting a goldthread region of the standard chip graph by using a dynamic threshold extraction algorithm, and calculating a gold thread area of the standard chip graph; S3, collecting a test picture, and calculating the gold thread area of the test picture; S4, if the gold thread area of the test picture is 0, judging that the sample is unqualified, and judging that the sample is not wired; if the gold thread area of the test picture is greater than 0, entering the next step; S5, positioning a gold thread accurate region of the test chart through the mark points on the standard chip chart, and obtaining a pixel point matrix set of gold threads on the test chart according to the gold thread accurate region of the test chart; and S6, extracting defect characteristics of the gold thread area on the test picture according to the pixel point matrix set of the gold thread on the test picture, and judging whether the gold thread of the chip is qualified or not according to the defect characteristics. The gold thread can be accurately positioned and subjected to defect detection, and the detection precision is high.

Description

technical field [0001] The invention relates to the technical field of gold wire detection, in particular to a gold wire detection method for packaged chips. Background technique [0002] With the rapid development of integrated circuits, advanced packaging technology is constantly evolving to meet the stringent requirements and challenges of various new semiconductor processes and materials. The physical connection between the packaged chip and the outside world, to ensure that the chip can respond correctly to the input and output of the outside world, has become the key to the entire packaging process. The wire bonding technology is currently the dominant packaging method, and more than 90% of the interconnection between chips and external packages on the market adopts this process. It is called "Bonding" in the chip gold wire industry, and the machine that completes this process is a bonding machine, commonly known as a "wire bonding machine". Although the existing pac...

AI Technical Summary

Problems solved by technology

[0003] At present, the inspection of packaged chips is basically manual inspection, and manual inspection is very easy to fatigue, the inspection effect is poor, and the working time is also limited; large packaging companies often need to train a large number of professional inspectors to cope with the increasing complexity of packaging Testing needs, high training costs, fierce competition within the industry, and easy loss of personnel

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