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Bonded ceramic having channel through which fluid can flow, and method for manufacturing same

A technology of ceramics and flow channels, which is applied in the field of bonded ceramics and its preparation, can solve the problems of reduced bonding strength, low bonding strength, and difficulty in application, and achieve the effect of excellent strength

Inactive Publication Date: 2020-07-17
トカイカーボンコリアカンパニーリミティド
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In addition, compared with the temperature condition of 25℃, the adhesive strength of epoxy resin will be reduced to less than half at the temperature of 80℃.
Therefore, it is difficult to use conventional ceramic bonding in high-temperature environments, and it is difficult to apply to fields requiring high strength in high-temperature environments due to low bonding strength

Method used

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  • Bonded ceramic having channel through which fluid can flow, and method for manufacturing same
  • Bonded ceramic having channel through which fluid can flow, and method for manufacturing same

Examples

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preparation example Construction

[0052] According to an embodiment of the present invention, a method for preparing a bonded ceramic having flow channels for flowable fluids includes the following steps: polishing (polishing) one side of a first ceramic substrate and one side of a second ceramic substrate; Patterns are formed on one side of the first ceramic substrate, one side of the polished second ceramic substrate, or both sides; and bonding the one side of the first ceramic substrate forming the pattern and the second ceramic substrate forming the pattern One side of the ceramic substrate thus achieves contact.

[0053] According to one aspect, in the adhering step, a fluid flow path may be formed according to the pattern of the first ceramic substrate and the pattern of the second ceramic substrate. The fluid flow channel is formed according to the patterns of the first ceramic substrate and the second ceramic substrate, and the size and shape of the flow channel are determined according to the size and...

Embodiment

[0067] The bonding surface of two silicon carbides having a grain size of about 10 μm and a thickness of 2 mm is polished (Polishing), and a pattern is formed on the polished surface.

[0068] Laminate in such a way that the polished surfaces face each other, and at a temperature of 2000°C and 10kg / cm 2 The load was maintained for 10 hours.

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Abstract

The present invention relates to a bonded ceramic having a channel through which a fluid can flow, and a method for manufacturing the same and, more particularly, to a bonded ceramic having a channelthrough which a fluid can flow, and a method for manufacturing the same, the bonded ceramic comprising: a first ceramic base material; and a second ceramic base material, wherein: the first ceramic base material and the second ceramic base material are bonded by adhesive layer-free bonding; a pattern is formed on either or both of the bonding surface of the first ceramic base material where the first ceramic base material comes in contact with the second ceramic base material and the bonding surface of the second ceramic base material where the second ceramic base material comes in contact with the first ceramic base material; and the bonded ceramic comprises pores having a size of 0.01 [mu]m to 50 [mu]m and formed along the bonding surface between the first ceramic base material and the second ceramic base material.

Description

technical field [0001] The present invention relates to a bonded ceramic formed with a flow channel for a flowable fluid and a preparation method thereof, more particularly, to a bonded ceramic with a flow channel for a flowable fluid that can be bonded without an adhesive layer Ceramics and methods of making them. Background technique [0002] Various ceramic materials are widely used in electronic components, biological materials, heat-resistant and wear-resistant structural components and other fields. When ceramic materials are used, ceramic materials are used alone only in special cases, usually by bonding between ceramic materials and bonding between ceramic materials and metal materials. Bonding between ceramic materials and bonding between ceramic materials and metal materials is usually achieved by an adhesive made of epoxy resin or the like. [0003] In addition, compared with the temperature condition of 25°C, the adhesive strength of the epoxy resin will be red...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/00H01L21/683
CPCC04B37/001C04B2235/785C04B2235/786C04B2237/34C04B2237/341C04B2237/343C04B2237/348C04B2237/365C04B2237/366C04B2237/368C04B2237/52C04B2237/64H01L21/67109H01L21/6838C04B2237/62H01L21/6831B32B18/00B32B37/00B32B37/06B32B38/00B32B2037/0092B32B2038/0064B32B2315/02B32B2457/00C04B2237/704
Inventor 薛昶煜
Owner トカイカーボンコリアカンパニーリミティド