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Circuit board unit, circuit assembly, computer power supply and computer

A circuit board unit, computer power supply technology, applied in the field of electronics, can solve problems such as large volume, and achieve the effects of reducing volume, saving assembly processes, and improving production efficiency

Pending Publication Date: 2020-07-21
深圳市瑞声元科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the above-mentioned present situation, the main purpose of the present invention is to provide a circuit board unit, a circuit assembly, a computer power supply, and a computer to solve the problem that the existing circuit board is provided with an independent heat dissipation or heat conduction structure and the volume is too large

Method used

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  • Circuit board unit, circuit assembly, computer power supply and computer
  • Circuit board unit, circuit assembly, computer power supply and computer
  • Circuit board unit, circuit assembly, computer power supply and computer

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Embodiment Construction

[0040] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the present invention, some specific details are described in detail, and in order to avoid obscuring the essence of the present invention, known methods, procedures, procedures, and components are not described in detail.

[0041] Additionally, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0042] Unless the context clearly requires, throughout the specification and claims, "comprises", "comprises" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive meaning; that is, "including but not limited to" meaning.

[0043] In the description of the present invention, it should be understood that the terms "first", "second" and so on are used for descriptive purp...

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PUM

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Abstract

The invention provides a circuit board unit, a circuit assembly, a computer power supply and a computer, the circuit board unit comprises at least one circuit board, the circuit board comprises a plurality of electrical connection layers arranged in a laminated manner, and the circuit board is provided with an electrical connection structure used for connecting electronic components; at least onecircuit board is a multiplexing board, at least one of the two electrical connection layers at the outermost side of the multiplexing board is a heat conduction layer, the heat conduction layer is a copper foil layer, the heat conduction layer is provided with an exposed area, and the exposed area is exposed out of the multiplexing board; and in the multiplexing board, at least part of the electrical connection structure is located in the exposed area. According to the invention, an independent heat dissipation or cooling structure is reduced or even not arranged on the circuit board, so thatthe volume of the whole circuit assembly can be reduced, the overall structural design of a product is facilitated, and particularly the structural design of a small product is facilitated to better meet the requirements of users.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a circuit board unit, a circuit assembly, a computer power supply, and a computer. Background technique [0002] At present, circuit boards are widely used in various electronic and electrical products. With the improvement of the performance of these products, many high-power electronic components need to be installed on the circuit board. These electronic components generate serious heat. In order to To ensure the normal operation of the product, in the existing technology, a special heat dissipation or heat conduction structure is often set outside the circuit board, such as connecting aluminum sheet structures such as heat dissipation fins on the circuit board, and some even directly set a special cooling system directly inside the product Devices, such as the flow of coolant to conduct heat away, to better ensure the normal operation of the product. [0003] However, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/18G06F1/20
CPCG06F1/184G06F1/189G06F1/20H05K7/20172H05K7/205H05K7/209H05K7/20909
Inventor 李剑英黎惇昊
Owner 深圳市瑞声元科技有限公司