Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flow guide bonding pad

A pad and PCB board technology, applied in the field of battery management system welding, can solve problems such as poor welding stability, and achieve the effect of good welding flatness and firm welding

Inactive Publication Date: 2020-07-28
度普(苏州)新能源科技有限公司 +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, at present, the welding stability between the nickel sheet and the PCB board is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flow guide bonding pad
  • Flow guide bonding pad
  • Flow guide bonding pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0033] refer to figure 1 , figure 1 A schematic structural diagram of a battery management system provided by an embodiment of the present invention, the battery management system includes: a PCB board 11, a batt...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
widthaaaaaaaaaa
lengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a flow guide bonding pad. The flow guide bonding pad comprises a first bonding pad and a second bonding pad, wherein the first bonding pad is located between a nickel sheet anda PCB, and at least one opening penetrating through the first bonding pad is formed in the first bonding pad; the second bonding pad is positioned in the opening; a via hole is formed in the center area of the second bonding pad, at least one flow guide structure is arranged on the surface, which is adjacent to the PCB, of the second bonding pad, and one end of each flow guide structure is communicated with the outer diameter of the via hole. According to the flow guide bonding pad, the welding stability and flatness between the nickel sheet and the PCB are improved.

Description

technical field [0001] The present invention relates to the technical field of battery management system welding, and more specifically, to a current-conducting pad. Background technique [0002] With the increasing use of electric vehicles and the continuous improvement of battery capacity, the number of battery cells is also increasing, resulting in a rapid increase in the collection of battery cells. [0003] In order to reduce the usage of the collection harness and improve the reliability of the battery cell collection, a technology that replaces the wiring harness by directly collecting the voltage of the battery cell through the nickel sheet on the PCB has emerged as the times require. [0004] However, at present, the soldering stability between the nickel sheet and the PCB board is poor. Contents of the invention [0005] In view of this, in order to solve the above problems, the present invention provides a conduction pad, the technical solution is as follows: ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H01M10/42B23K3/00B23K3/08
CPCB23K3/00B23K3/08H01M10/425H01M2010/4271H05K1/116Y02E60/10
Inventor 熊祥周志军李昊董旭峰
Owner 度普(苏州)新能源科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com