Housing components and electronics

A shell assembly and shell technology, applied in the electronic field, can solve problems such as high temperature, affecting the shooting performance of the camera, affecting the performance of the surrounding shell of the camera, etc., and achieve the effect of avoiding local high temperature

Active Publication Date: 2022-05-31
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the use of electronic equipment, the camera has become one of the main heating elements of electronic equipment. If the camera cannot be effectively dissipated, on the one hand, the temperature of the camera is too high, which will affect the shooting performance of the camera itself; on the other hand, the temperature of the camera is too high. High temperature will also affect the performance of the surrounding shell of the camera, forming a phenomenon of local high temperature on the shell

Method used

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  • Housing components and electronics
  • Housing components and electronics
  • Housing components and electronics

Examples

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Embodiment Construction

loaded, and will not be repeated here. The electronic device 1000 according to the embodiment of the present application is provided between the rear case 112 and the first graphite sheet 121

The foam 134, on the one hand, utilizes the heat insulating holes 131 on the foam 134 to insulate heat from being transmitted to the casing 110 in the vertical direction

This can prevent the outer surface temperature of the casing 110 from being too high; on the other hand, the foam 134 is disposed between the camera module and the rear casing 112

In the meantime, the foam 134 can provide buffer protection for the camera module to prevent the camera module from being damaged under the action of external force.

At the same time, the insulating holes 131 are formed on the foam 134 , compared with the solution of opening the insulating holes 131 on the platen support 133 , there is no problem.

The structural strength of the platen bracket 133 is reduced.

[0065] In the above-mentioned...

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Abstract

Embodiments of the present application provide a casing assembly and electronic equipment. The casing assembly includes a casing, a first heat sink, and a first heat insulation element. The first heat dissipation element is used to connect with a heat source; the first heat insulation element is located Between a heat sink and the housing, the first heat insulating member is provided with a heat insulating hole, and the heat insulating hole penetrates the first heat insulating member from the first heat sink toward the housing. Based on this, in the housing assembly of the embodiment of the present application, the first heat dissipation member can conduct the heat generated by the heat source into the air, so as to realize the heat dissipation of the heat source. At the same time, a heat insulation hole is provided on the first heat insulation member. When the air is filled in the heat insulation hole, the first heat insulation member can prevent the heat dissipated by the first heat dissipation member from continuing to pass through the first heat insulation member in large quantities. The heat insulation hole on the component is transmitted to the shell, thereby avoiding the phenomenon of local high temperature on the surface of the shell caused by the heat source.

Description

Housing components and electronic equipment technical field [0001] The present application relates to the field of electronic technology, in particular to a housing assembly and an electronic device. Background technique [0002] With the improvement of the consumption level, the user's requirements for electronic equipment are also getting higher and higher. Cameras have become electronic A must-have module for the device. In the use process of electronic equipment, camera has become one of the main heating elements of electronic equipment, if The camera cannot be effectively cooled. On the one hand, the high temperature of the camera will affect the shooting performance of the camera itself. On the one hand, if the temperature of the camera is too high, the performance of the casing surrounding the camera will also be affected, and local high temperature will be formed on the casing. SUMMARY OF THE INVENTION Embodiments of the present application provide a housi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G03B17/55G03B30/00
CPCH05K7/2039G03B17/55
Inventor 严慎波钟进志曾鸿敏周连利陈仕权
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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