Heat dissipation air supply device for burn-in test boards in semiconductor memory burn-in test equipment

Abstract

The invention discloses a heat dissipation air supply device for aging test boards in semiconductor memory aging test equipment, which includes an aging test board side joint assembly connected to a heat insulation cavity and an air source side joint assembly. The air source side joint assembly includes the same The plug, compression spring, air source sealing seat and air pipe interface provided by the shaft, the plug and compression spring are arranged in the air source sealing seat, the compression spring is set between the plug and the air pipe interface under pressure, the air source sealing seat and the air pipe The interface is fixedly connected, and the aging test board side joint assembly exerts a force opposite to the compression spring on the plug when connecting, and a first sealing ring is arranged between the contact end faces of the aging test board side joint assembly and the air source side joint assembly. The present invention adopts the aging test board card side joint assembly and the air source side joint assembly to be inserted and matched and sealed with a sealing ring to ensure the heat insulation effect; the present invention adopts a compressed spring structure, the failure rate of the mechanism is low, and the overall structural performance and work are improved. life.

Description

technical field [0001] The invention relates to the technical field of semiconductor aging test, in particular to a heat dissipation and air supply device for an aging test board card in a semiconductor memory aging test equipment. Background technique [0002] Semiconductor memory has a certain failure probability, and the relationship between the failure probability and the number of times of use conforms to the characteristics of the bathtub curve. Therefore, in order to avoid the problem of high failure probability at the beginning of the use of semiconductor memory, semiconductor memory manufacturers generally accelerate the occurrence of the failure probability of semiconductor memory through aging tests, and directly put the product into a stable period and screen out good products. [0003] With the rapid development of semiconductor manufacturing technology, high-speed and high-capacity semiconductor memories are emerging one after another, and the demand for semico...

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Problems solved by technology

[0005] like figure 1 As shown in , in the semiconductor memory aging test equipment of the existing scheme, the joint of the air source assembly adopts the structure of the torsion spring 300 and the windshield 200 to seal (such as figure 1 Most right); After the insertion of the trachea 100, the windshield 200 of the two splits is gradually pushed away by the trachea 100 and rotates around the torsion spring 300 (as figure 1 middle); when the trachea 100 is fully inserted (such as figure 1 Leftmost), there will still be a gap between the side wall of the air pipe 100 and the windshield 200, so the sealing effect cannot meet the strict requirements of the airtightness of the BIB board heat insulation cavity

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