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Gluing method

A technology of gluing and gluing device, which is applied in the field of gluing, and can solve the problems that the uniformity of coating cannot be guaranteed, the normal process of coating is hindered, and the spray holes are easily blocked.

Active Publication Date: 2020-08-07
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is only suitable for coating photoresist with low dynamic viscosity, and photoresist with high dynamic viscosity is easy to block the spray hole, which cannot guarantee the uniformity of coating, and even hinders the normal process of coating.

Method used

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Embodiment Construction

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. As used herein, "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items.

[0031] ...

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Abstract

The invention provides a gluing method. The gluing method comprises eccentric spraying treatment, centering spraying treatment and film forming treatment. According to the gluing method, the center ofthe bottom of the spraying part is made to right face the first position of the surface of the to-be-treated substrate through the position control part, the linear distance between the first position and the center of the to-be-treated substrate is larger than 0, and then eccentric spraying treatment is carried out; after the eccentric spraying treatment is finished, the center of the bottom ofthe spraying part is aligned to the center of the surface of the to-be-treated substrate; the pattern transfer medium can form annular and central point-like distribution on the surface of the to-be-treated substrate, so that good-uniformity and chromatic aberration-free light resistance can be further formed on the surface of the to-be-treated substrate through the film forming processing.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a gluing method. Background technique [0002] Wafer coating photoresist equipment is one of the core equipment in the photolithography process in the field of semiconductor manufacturing, and the glue coating unit is the most important functional unit. After the wafer passes through the gluing unit, the surface of the wafer will be coated with a photoresist with a target thickness. The uniformity of the photoresist coating directly affects the stability of the line width during subsequent exposure. With the continuous shrinking of the line width of semiconductor devices, the uniformity of photoresist coating is more and more stringent, so it is particularly important to improve the process effect of the glue coating unit. [0003] Publication number is that the patent application of CN110879509A discloses a kind of gluing method, and this method is arranged on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16
CPCG03F7/162
Inventor 张晨阳朴勇男邢栗
Owner SHENYANG KINGSEMI CO LTD
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